JPH0195757U - - Google Patents
Info
- Publication number
- JPH0195757U JPH0195757U JP19182787U JP19182787U JPH0195757U JP H0195757 U JPH0195757 U JP H0195757U JP 19182787 U JP19182787 U JP 19182787U JP 19182787 U JP19182787 U JP 19182787U JP H0195757 U JPH0195757 U JP H0195757U
- Authority
- JP
- Japan
- Prior art keywords
- metal terminal
- chip
- view
- input
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の一実施例による高周波半導
体電子装置を示す平面図であり、第２図は、第１
図Ａ―Ａ′での断面図を示す。第３図は、本考案
の他の実施例を示す平面図であり、第４図は第３
図のＡ―Ａ′での断面図である。第５図は、従来
の半導体電子装置を示す平面図であり、第６図は
第５図のＡ―Ａ′での断面図である。
１……入出力ライン、２……ボンデイングワイ
ヤー、３……キヤツプ取付部、４……ＩＣチツプ
、５……パツケージ、６……金属端子、７……単
板コンデンサ。
FIG. 1 is a plan view showing a high frequency semiconductor electronic device according to an embodiment of the present invention, and FIG.
A sectional view taken along the line A-A' is shown. FIG. 3 is a plan view showing another embodiment of the present invention, and FIG. 4 is a plan view showing another embodiment of the present invention.
It is a sectional view taken along line AA' in the figure. FIG. 5 is a plan view showing a conventional semiconductor electronic device, and FIG. 6 is a sectional view taken along line AA' in FIG. 1... Input/output line, 2... Bonding wire, 3... Cap mounting part, 4... IC chip, 5... Package, 6... Metal terminal, 7... Single plate capacitor.
Claims (1)
設置されており、前記金属端子と、ＩＣチツプと
がボンデイングワイヤーにて接続されていること
を特徴とする高周波半導体装置。 A high-frequency semiconductor device characterized in that a metal terminal is installed at an input/output section inside a semiconductor package, and the metal terminal and an IC chip are connected with a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19182787U JPH0195757U (en) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19182787U JPH0195757U (en) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195757U true JPH0195757U (en) | 1989-06-26 |
Family
ID=31482719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19182787U Pending JPH0195757U (en) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195757U (en) |
-
1987
- 1987-12-16 JP JP19182787U patent/JPH0195757U/ja active Pending