JPH0193772U - - Google Patents
Info
- Publication number
- JPH0193772U JPH0193772U JP18939487U JP18939487U JPH0193772U JP H0193772 U JPH0193772 U JP H0193772U JP 18939487 U JP18939487 U JP 18939487U JP 18939487 U JP18939487 U JP 18939487U JP H0193772 U JPH0193772 U JP H0193772U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- multilayer wiring
- electronic component
- buried
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18939487U JPH0193772U (pt) | 1987-12-15 | 1987-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18939487U JPH0193772U (pt) | 1987-12-15 | 1987-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193772U true JPH0193772U (pt) | 1989-06-20 |
Family
ID=31480424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18939487U Pending JPH0193772U (pt) | 1987-12-15 | 1987-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193772U (pt) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03273919A (ja) * | 1990-03-23 | 1991-12-05 | Nissan Shatai Co Ltd | 車高調整装置 |
| JPH0432565U (pt) * | 1990-07-11 | 1992-03-17 | ||
| JPH09312478A (ja) * | 1996-05-22 | 1997-12-02 | Nec Niigata Ltd | 多層配線基板 |
| JPH11307894A (ja) * | 1998-04-27 | 1999-11-05 | Kenichi Ito | プリント配線基板 |
| JP2001035990A (ja) * | 1999-07-22 | 2001-02-09 | Kyocera Corp | 半導体装置 |
| JP2001210955A (ja) * | 2000-01-27 | 2001-08-03 | Matsushita Electric Ind Co Ltd | 部品内蔵両面配線板の製造方法、及び電子回路構成体の製造方法 |
| JP2001298274A (ja) * | 2001-03-13 | 2001-10-26 | Matsushita Electric Ind Co Ltd | 電子回路構成体 |
| JP2018093011A (ja) * | 2016-12-01 | 2018-06-14 | 株式会社村田製作所 | コンデンサの実装構造 |
| JP2021052082A (ja) * | 2019-09-25 | 2021-04-01 | キオクシア株式会社 | モジュール基板およびプリント基板 |
-
1987
- 1987-12-15 JP JP18939487U patent/JPH0193772U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03273919A (ja) * | 1990-03-23 | 1991-12-05 | Nissan Shatai Co Ltd | 車高調整装置 |
| JPH0432565U (pt) * | 1990-07-11 | 1992-03-17 | ||
| JPH09312478A (ja) * | 1996-05-22 | 1997-12-02 | Nec Niigata Ltd | 多層配線基板 |
| JPH11307894A (ja) * | 1998-04-27 | 1999-11-05 | Kenichi Ito | プリント配線基板 |
| JP2001035990A (ja) * | 1999-07-22 | 2001-02-09 | Kyocera Corp | 半導体装置 |
| JP2001210955A (ja) * | 2000-01-27 | 2001-08-03 | Matsushita Electric Ind Co Ltd | 部品内蔵両面配線板の製造方法、及び電子回路構成体の製造方法 |
| JP2001298274A (ja) * | 2001-03-13 | 2001-10-26 | Matsushita Electric Ind Co Ltd | 電子回路構成体 |
| JP2018093011A (ja) * | 2016-12-01 | 2018-06-14 | 株式会社村田製作所 | コンデンサの実装構造 |
| JP2021052082A (ja) * | 2019-09-25 | 2021-04-01 | キオクシア株式会社 | モジュール基板およびプリント基板 |