JPH0193157A - Plug-in type package - Google Patents

Abstract

PURPOSE:To make possible a highly integrated packaging without needing a reduction in the pitch between the wirings of a printed-wiring board and the formation in a multilayer structure of a wiring layer by a method wherein external connecting pins are provided on the surface and rear of a plug-in type ceramic package. CONSTITUTION:External connecting pins 4' are provided on the surface side of a package as well in addition to external connecting pins 4 on the rear side of a conventional package. These pins 4 and 4' are connected to bonding pads 3 in a cavity 5 by wiring patterns in the interior of a ceramic substrate 1. The size of the plug-in type package is the same size as that of the conventional package, but this plug in type package can being capable of housing a semiconductor circuit chip having terminals of a number more than the number of the terminals of a semiconductor circuit chip to be housed in the conventional package.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a package for a semiconductor integrated circuit, and in particular to a package for accommodating a scribed semiconductor chip after die processing in the manufacturing process of a semiconductor integrated circuit, and for mounting it on a printed wiring board. This invention relates to plug-in packages for semiconductor integrated circuits to be mounted.

[Conventional technology]

Most of the conventional plug-in type ceramic packages have the shape shown in FIG.

, FIGS. 3(a), 3(b), and 3(c) are a top view, a side view, and a back view, respectively, showing an example of a conventional plug-in type package. This package includes ceramic case 1.
Bonding pad 3. Seal ring 2. Cavity 5
．． It is composed of external connection lead pins 4 and the like.

FIG. 4 shows a schematic cross-sectional view of an example of mounting this conventional package on a printed wiring board.

[Problem that the invention seeks to solve]

In the conventional semiconductor integrated circuit device package described above, when the circuit function is divided into multiple semiconductor integrated circuit chips and configured as a single multi-bin plug-in type ceramic package, the size becomes even larger due to the increase in the number of external connection lead pins. Therefore, in order to mount this on a printed wiring board, it is necessary to reduce the wiring pitch of the printed wiring board and increase the number of wiring layers more than before, and furthermore, it is necessary to keep this to the conventional size as a ceramic package. The disadvantage of this method is that the pin diameter and pin pitch of external connection lead pins must be reduced.

[Means for solving problems]

The plug-in package of the present invention includes a multilayer ceramic substrate including a cavity for mounting a semiconductor chip, a plurality of bonding pads provided around the cavity, and a seal ring provided around the bonding pads. External connection lead pins are provided on both surfaces of the multilayer ceramic substrate, each of which is connected to the bonding pad through a wiring pattern within the multilayer ceramic substrate.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(a), (b), and (c) are a top view, a side view, and a back view, respectively, showing a first embodiment of the present invention.

In addition to the external connection lead pins 4 on the back side of the package in the conventional example shown in FIG. 3, external connection lead pins 4' are also provided on the front side of the package. The wiring pattern (not shown) is connected to the bonding pad 3 in the cavity, and the structure is capable of accommodating a semiconductor integrated circuit chip having the same size as a conventional package but having a larger number of terminals. -.

FIG. 5 shows a schematic cross-sectional view of an example of mounting a semiconductor device on a printed wiring board using this embodiment.

FIGS. 2(a), (b), and (c) are a top view, a side view, and a back view, respectively, of a second embodiment of the present invention.

It has a shape in which two external connection lead bins are drawn out on the front side with a cavity and are bonded together on the back side, and has the feature of being able to mount two semiconductor chips.

An external connection lead pin 4' on the front side of the package and an external connection lead pin 4'' on the back side are provided, and these external connection lead pins 4', 4'' are connected to bonding pads 3. 3
', and the semiconductor chips may be interconnected by an internal wiring pattern of the ceramic substrate. It is possible to realize a structure that can accommodate a semiconductor integrated circuit chip having a larger number of terminals while having the same size as a conventional package.

FIG. 6 shows a schematic cross-sectional view of an example of mounting a semiconductor device on a printed wiring board using this embodiment.

〔Effect of the invention〕

As explained above, by providing external connection lead bins on both the front and back surfaces of a plug-in type ceramic package, the present invention makes it possible to mount a semiconductor chip with a larger number of terminals than before even though the package shape is the same. When mounting the device on a printed wiring board, there is an effect that high-density mounting can be achieved without reducing the wiring pitch of the printed wiring board or increasing the number of wiring layers.

[Brief explanation of the drawing]

Figures 1 (a), (b) and (C) are a plan view, side view and back view showing the first embodiment of the present invention, respectively, and Figure 2 (
a), (b), and (C) are respectively a plan view, a side view, and a back view showing the second embodiment; FIGS. 3(a), (b), and (c) are plan views of the conventional example, respectively; side view and back view,
FIG. 4, FIG. 5, and FIG. 6 are schematic cross-sectional views of examples of mounting a semiconductor device on a printed wiring board using the conventional example, the first embodiment, and the second embodiment, respectively. 1.1'... Ceramic substrate, 2... Seal ring, 3... Bonding pad, 4.4', 4''...
・External connection lead bin, 5. Cavity, 11°11'
...Printed wiring board.

Claims (1)

[Claims] The bonding pads are placed on both sides of a multilayer ceramic substrate that includes a cavity for mounting a semiconductor chip, a plurality of bonding pads provided around the cavity, and a seal ring provided around the bonding pads. A plug-in type package characterized in that a lead pin for external connection is provided which is connected to a wiring pattern within the multilayer ceramic substrate.