JPH0192148U - - Google Patents
Info
- Publication number
- JPH0192148U JPH0192148U JP18745087U JP18745087U JPH0192148U JP H0192148 U JPH0192148 U JP H0192148U JP 18745087 U JP18745087 U JP 18745087U JP 18745087 U JP18745087 U JP 18745087U JP H0192148 U JPH0192148 U JP H0192148U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- electrode
- electrode connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Description
第１図乃至第３図は本考案固体撮像装置の一つ
の実施例を説明するためのもので、第１図は断面
図、第２図はレンズの底面図、第３図は固体撮像
素子の平面図、第４図は第１の実施例の変形例を
示すレンズの底面図、第５図及び第６図はそれぞ
れ第１の実施例の更に別の実施例を示す断面図、
第７図は本考案固体撮像装置の第２の実施例を示
す断面図、第８図は本考案固体撮像装置の第３の
実施例を示す断面図である。
符号の説明、１……固体撮像素子、２……電極
、３，３ａ，３ｂ，１６……光学部材、４，４ａ
，４ｂ……配線膜、５……電極接続部。
Figures 1 to 3 are for explaining one embodiment of the solid-state imaging device of the present invention. Figure 1 is a sectional view, Figure 2 is a bottom view of the lens, and Figure 3 is a diagram of the solid-state imaging device. A plan view, FIG. 4 is a bottom view of a lens showing a modification of the first embodiment, and FIGS. 5 and 6 are sectional views showing still another embodiment of the first embodiment, respectively.
FIG. 7 is a sectional view showing a second embodiment of the solid-state imaging device of the present invention, and FIG. 8 is a sectional view showing a third embodiment of the solid-state imaging device of the invention. Explanation of symbols, 1... Solid-state image sensor, 2... Electrode, 3, 3a, 3b, 16... Optical member, 4, 4a
, 4b... Wiring film, 5... Electrode connection part.
Claims (1)
面に形成された光学部材と、 上記各電極接続部に対応した位置に電極が形成
された固体撮像素子と、 を有し、 上記光学部材の配線膜の電極接続部に上記固体
撮像素子の電極が直接接続されてなる ことを特徴とする固体撮像装置。[Claims for Utility Model Registration] An optical member formed on one main surface of a plurality of wiring films each having an electrode connection portion in a part thereof, and a solid-state imaging device having electrodes formed at positions corresponding to each of the electrode connection portions. What is claimed is: 1. A solid-state imaging device comprising: an electrode of the solid-state imaging device, the electrode of the solid-state imaging device being directly connected to an electrode connection portion of a wiring film of the optical member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18745087U JPH0192148U (en) | 1987-12-09 | 1987-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18745087U JPH0192148U (en) | 1987-12-09 | 1987-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0192148U true JPH0192148U (en) | 1989-06-16 |
Family
ID=31478604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18745087U Pending JPH0192148U (en) | 1987-12-09 | 1987-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0192148U (en) |
-
1987
- 1987-12-09 JP JP18745087U patent/JPH0192148U/ja active Pending
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