JPS62170647U - - Google Patents
Info
- Publication number
- JPS62170647U JPS62170647U JP1986057902U JP5790286U JPS62170647U JP S62170647 U JPS62170647 U JP S62170647U JP 1986057902 U JP1986057902 U JP 1986057902U JP 5790286 U JP5790286 U JP 5790286U JP S62170647 U JPS62170647 U JP S62170647U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state imaging
- imaging device
- package
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 description 1
Description
第１図は本考案の固体撮像装置を示し、同図ａ
は平面図、同図ｂ及びｃは断面図、第２図は従来
装置を示し、同図ａは平面図、同図ｂ及びｃは断
面図、第３図ａ及びｂは本考案装置の一実施例要
部断面図及び平面図、第４図は本考案装置の他の
実施例の要部平面図、第５図は本考案装置のさら
に他の実施例の要部断面図である。
１，１′…パツケージ、２…固体撮像素子、３
，３′…光学フイルタ、５…ワイヤ、３０…拡散
フイルタ部。
Figure 1 shows the solid-state imaging device of the present invention, and the figure a
2 is a plan view, b and c are sectional views, FIG. 2 is a conventional device, a is a plan view, b and c are sectional views, and FIG. 4 is a sectional view and a plan view of the main parts of the embodiment, FIG. 4 is a plan view of the main parts of another embodiment of the device of the present invention, and FIG. 5 is a sectional view of the main parts of still another embodiment of the device of the present invention. 1, 1'...Package, 2...Solid-state image sensor, 3
, 3'... Optical filter, 5... Wire, 30... Diffusion filter section.
Claims (1)
像装置に於いて、該固体撮像素子上に接合され該
素子への入射光を制御する光学フイルタ板の周辺
部を一部拡張した拡張フイルタ部を設け、この拡
張フイルタ部は固体撮像素子とパツケージの端子
との電気的接続を行なうワイヤ上に配置され、該
ワイヤを遮光する事を特徴とした固体撮像装置。 In a solid-state imaging device in which a solid-state imaging device is housed in a package, an expansion filter portion is provided, which is a partially expanded peripheral portion of an optical filter plate bonded onto the solid-state imaging device and controlling incident light to the device; A solid-state imaging device characterized in that the expansion filter section is disposed on a wire that electrically connects a solid-state imaging device and a terminal of a package, and shields the wire from light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986057902U JPS62170647U (en) | 1986-04-17 | 1986-04-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986057902U JPS62170647U (en) | 1986-04-17 | 1986-04-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62170647U true JPS62170647U (en) | 1987-10-29 |
Family
ID=30888018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986057902U Pending JPS62170647U (en) | 1986-04-17 | 1986-04-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62170647U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013172234A1 (en) * | 2012-05-18 | 2013-11-21 | 浜松ホトニクス株式会社 | Spectroscopic sensor |
| US9273999B2 (en) | 2012-05-18 | 2016-03-01 | Hamamatsu Photonics K.K. | Spectroscopic sensor |
| US9846076B2 (en) | 2012-05-18 | 2017-12-19 | Hamamatsu Photonics K.K. | Spectral sensor |
-
1986
- 1986-04-17 JP JP1986057902U patent/JPS62170647U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013172234A1 (en) * | 2012-05-18 | 2013-11-21 | 浜松ホトニクス株式会社 | Spectroscopic sensor |
| JP2013242177A (en) * | 2012-05-18 | 2013-12-05 | Hamamatsu Photonics Kk | Spectral sensor |
| US9273999B2 (en) | 2012-05-18 | 2016-03-01 | Hamamatsu Photonics K.K. | Spectroscopic sensor |
| US9671286B2 (en) | 2012-05-18 | 2017-06-06 | Hamamatsu Photonics K.K. | Spectroscopic sensor having a wire connected to a substrate through a hole of a filter region |
| US9846076B2 (en) | 2012-05-18 | 2017-12-19 | Hamamatsu Photonics K.K. | Spectral sensor |