JPH0173952U - - Google Patents
Info
- Publication number
- JPH0173952U JPH0173952U JP1987168391U JP16839187U JPH0173952U JP H0173952 U JPH0173952 U JP H0173952U JP 1987168391 U JP1987168391 U JP 1987168391U JP 16839187 U JP16839187 U JP 16839187U JP H0173952 U JPH0173952 U JP H0173952U
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- substrate
- electrode
- integrated circuit
- sensor part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 2
Landscapes
- Facsimile Heads (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
第１図は本考案の第１の実施例を示す密着型イ
メージセンサの断面図、第２図は従来の密着型イ
メージセンサの一構成例を示す断面図、第３図は
第２図の平面図、第４図は第１図の平面図、及び
第５図は本考案の第２の実施例を示す密着型イメ
ージセンサの断面図である。
１１…駆動部基板、１２…駆動用ＩＣ、１５，
１５ａ…センサ部基板、１６…共通電極、１７…
光電変換膜、１８…個別電極、１９…センサ端子
、２０…センサ部。
FIG. 1 is a sectional view of a contact type image sensor showing a first embodiment of the present invention, FIG. 2 is a sectional view showing an example of the configuration of a conventional contact type image sensor, and FIG. 3 is a plan view of FIG. 2. 4 is a plan view of FIG. 1, and FIG. 5 is a sectional view of a contact type image sensor showing a second embodiment of the present invention. 11... Drive unit board, 12... Drive IC, 15,
15a...Sensor part substrate, 16...Common electrode, 17...
Photoelectric conversion film, 18...Individual electrode, 19...Sensor terminal, 20...Sensor section.
Claims (1)
れ該電極に接続されたセンサ端子を有するセンサ
部基板と、 前記センサ部を駆動する駆動用集積回路が設け
られた駆動部基板とを備えると共に、 前記駆動部基板上に前記センサ部基板を接着し
、前記センサ端子と前記駆動用集積回路とを直接
接続したことを特徴とする密着型イメージセンサ
。[Claims for Utility Model Registration] A drive comprising: a sensor part substrate having a sensor part formed with a photoelectric conversion film and an electrode and a sensor terminal connected to the electrode; and a driving integrated circuit for driving the sensor part. What is claimed is: 1. A close-contact image sensor, comprising: a component substrate; the sensor component substrate is adhered onto the driver substrate; and the sensor terminal and the driving integrated circuit are directly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168391U JPH0173952U (en) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168391U JPH0173952U (en) | 1987-11-02 | 1987-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173952U true JPH0173952U (en) | 1989-05-18 |
Family
ID=31457525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168391U Pending JPH0173952U (en) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173952U (en) |
-
1987
- 1987-11-02 JP JP1987168391U patent/JPH0173952U/ja active Pending