JPH019160Y2 - - Google Patents
Info
- Publication number
- JPH019160Y2 JPH019160Y2 JP1982142031U JP14203182U JPH019160Y2 JP H019160 Y2 JPH019160 Y2 JP H019160Y2 JP 1982142031 U JP1982142031 U JP 1982142031U JP 14203182 U JP14203182 U JP 14203182U JP H019160 Y2 JPH019160 Y2 JP H019160Y2
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- hole
- mounting area
- conductive
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000010354 integration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982142031U JPS5945929U (ja) | 1982-09-20 | 1982-09-20 | 半導体素子の実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982142031U JPS5945929U (ja) | 1982-09-20 | 1982-09-20 | 半導体素子の実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5945929U JPS5945929U (ja) | 1984-03-27 |
| JPH019160Y2 true JPH019160Y2 (US08124317-20120228-C00060.png) | 1989-03-13 |
Family
ID=30317485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982142031U Granted JPS5945929U (ja) | 1982-09-20 | 1982-09-20 | 半導体素子の実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5945929U (US08124317-20120228-C00060.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5761853U (US08124317-20120228-C00060.png) * | 1980-09-30 | 1982-04-13 |
-
1982
- 1982-09-20 JP JP1982142031U patent/JPS5945929U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5761853U (US08124317-20120228-C00060.png) * | 1980-09-30 | 1982-04-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5945929U (ja) | 1984-03-27 |
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