JPH019105Y2 - - Google Patents

Info

Publication number
JPH019105Y2
JPH019105Y2 JP10166084U JP10166084U JPH019105Y2 JP H019105 Y2 JPH019105 Y2 JP H019105Y2 JP 10166084 U JP10166084 U JP 10166084U JP 10166084 U JP10166084 U JP 10166084U JP H019105 Y2 JPH019105 Y2 JP H019105Y2
Authority
JP
Japan
Prior art keywords
connection
ray source
board
flexible film
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10166084U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6033781U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10166084U priority Critical patent/JPS6033781U/ja
Publication of JPS6033781U publication Critical patent/JPS6033781U/ja
Application granted granted Critical
Publication of JPH019105Y2 publication Critical patent/JPH019105Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
JP10166084U 1984-07-04 1984-07-04 接続装置 Granted JPS6033781U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10166084U JPS6033781U (ja) 1984-07-04 1984-07-04 接続装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10166084U JPS6033781U (ja) 1984-07-04 1984-07-04 接続装置

Publications (2)

Publication Number Publication Date
JPS6033781U JPS6033781U (ja) 1985-03-07
JPH019105Y2 true JPH019105Y2 (ru) 1989-03-13

Family

ID=30239975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10166084U Granted JPS6033781U (ja) 1984-07-04 1984-07-04 接続装置

Country Status (1)

Country Link
JP (1) JPS6033781U (ru)

Also Published As

Publication number Publication date
JPS6033781U (ja) 1985-03-07

Similar Documents

Publication Publication Date Title
US7144471B2 (en) Bonding method and apparatus
JP3330037B2 (ja) チップ部品の接合方法および装置
JPH02258234A (ja) 結合剤の加熱により構造要素を連結する方法
US20070095280A1 (en) Method and apparatus for attaching a workpiece to a workpiece support
JPH04229693A (ja) 電子デバイスの表面実装方法
JPH032357B2 (ru)
JPH019105Y2 (ru)
JPS6349594B2 (ru)
JP3109757B2 (ja) テープキャリアパッケージと回路基板との接続方法
KR102678062B1 (ko) 레이저 본딩 시스템
JPH0223992B2 (ru)
KR20090107673A (ko) 전자부품의 접합 방법 및 장치
CN111702276B (zh) 激光热压加热吸嘴和器件焊接装置及热压复合加热方法
KR20080040151A (ko) 레이저 본딩장치 및 레이저 본딩방법
JPS6228069A (ja) レ−ザはんだ付け方法
JPS607893Y2 (ja) 接続装置
JPS607892Y2 (ja) 接続装置
JP2001068509A (ja) 半導体実装方法および半導体デバイス
JPH04306279A (ja) 異方性導電接着剤および接合構造
JPH0313944B2 (ru)
JP3442911B2 (ja) 樹脂パッケージ型半導体装置およびその製造方法
CN110648933A (zh) 一种邦定装置及邦定方法
CN221231778U (zh) 一种rosa热压焊装置
JP2662598B2 (ja) 回路接続装置
JPH04322492A (ja) Lcdに対するtcp接続方法およびその接続装置