JPH019105Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Technical Field> The present invention is designed to accurately connect two substrates over a wide area, particularly one rigid substrate to which components are attached and the connection terminal strip of the other flexible substrate. in close contact with
The present invention also relates to a device for reliable connection.

The present invention is suitable for a device that directly connects a hard board and a flexible multi-lead board by soldering without using a multi-connector.

<Prior art> For example, when a hard wiring board and a flexible wiring board are combined at one part and both wirings are connected at that part, the wiring on each wiring board is formed into a shape that matches each other at the part. However, at least one side of the wiring is finished with solder, and the conventional device connects both wiring boards by aligning each wiring and bringing them into close contact, and then irradiating infrared rays with an infrared lamp while they are in close contact to make a solder connection. is constructed as shown in FIGS. 6 and 7.

FIG. 6 is a half plan view showing the configuration of the above conventional example;
FIG. 7 is also a half-sectional side view. Gaskets 23a, 23b and presser fittings 2 are installed at several locations on the flange portion 22 of the container 21, which is made of deep drawn metal material.
4. By bolts 25a, 25b and nut 26,
The peripheral edge of the film 27 is tightened and fixed. Therefore, the container 21 and the film 27 form an airtight chamber 28. In short, the film 27 is airtight,
It is a material that can be elastically deformed under high temperature and high pressure, has heat resistance and mechanical strength, and is, for example, a polyimide film. An inflow pipe 29 for gas such as air or nitrogen gas or fluid such as water or oil is provided at the bottom of the container 21. One end of the several clips 30 is fixed to the flange 22 by a tightening bolt 25, and the other end is pressed against a hard substrate 33 by a substrate holding jig 32 via a height adjustment screw 31. The clip 30 is attached to a flexible substrate 34
At the same time as press the spacer 3 with that arm part
5 to press the film holding jig 36. The film holding jig 36 is made of a strong material such as metal that will not be deformed by the maximum pressure applied to the airtight chamber 28, and has an appropriate thickness. The film holding jig 36 adjusts the thickness of the spacer 35 and presses the film 2.
Since the substrates 7 are pressed so that they are substantially in one plane, the contact area at the connecting portion between the substrates 33 and 34 becomes large despite the presence of the stepped portion, and a sufficiently strong connection is achieved.

As shown in the figure, in order to connect the flexible substrate 34 to each of the four sides of the substrate 33, the film holding jig 36 is formed over the entire outer periphery of the substrate 33. A heat radiating plate 37 is provided to block heat rays from being applied to the parts 36 and to improve cooling at that part.

In the above conventional connection device, arrow A shown in the figure
The entire surface of the device is irradiated with infrared rays from the direction of. FIG. 8 shows the irradiation program. Such full-surface irradiation has the disadvantage that when the connection is completed, the film holding jig 36 is also heated and cannot be removed until it cools down. Furthermore, since the film is also heated, it also stretches itself.

<Purpose of the invention> In order to eliminate the above-mentioned drawbacks, the present invention moves a hot ray source along the connection terminal strip and successively irradiates the necessary wiring parts of the hard board and flexible board with hot rays one by one to connect them. The purpose is to provide a connection device that performs the following steps.

<Example> Embodiments of the present invention will be described below based on the drawings.

Fig. 1 is a plan view showing an embodiment in which the heat ray source is moved in two directions, Fig. 2 is a perspective view showing the heat ray source sending means of the above embodiment, and Fig. 3 is a small infrared spot lamp serving as the heat ray source. FIG.

In FIG. 1, the means for fixing two substrates to be connected is the same as in the conventional example described above. However, the heat sink 37 is not necessary in the embodiment of the present invention and is therefore omitted. Further, a feeding means for moving the small infrared spot lamp 1 along the connection terminal strip is composed of a drive section 2, a feed screw 3, a guide shaft 4, a carriage 5, and a relay device 6. The small infrared spot lamp 1 is supported by an arm 7 on a carriage 5. The carriage 5 moves in parallel with the connection terminal strip according to the guide shaft 4.

As shown in FIG. 3, the small infrared spot lamp 1 consists of an infrared lamp 8 and a reflector 9. Infrared rays generated by the infrared lamp 8 are reflected by a reflecting mirror 9, and the reflected light beams are focused on a focal point.

Next, the operation and usage of the embodiment of the present invention will be explained. The feeding time is set in accordance with the length of the connection terminal strip and controlled by the relay device 6. Within that time, the small infrared spot lamp 1 fixed to the carriage 5 moves while locally irradiating the connection terminal strip. In the above embodiment, an apparatus in which two heat sources are moved along two mutually orthogonal sides has been described, but it is also possible to perform heat ray irradiation in four directions simultaneously using heat sources on four sides.

FIG. 4 is a diagram illustrating the adhesive force when connecting according to the present invention. Board 10 and lead wire 1
In order to determine the connection state with lead wire 11
The tensile strength was measured when the substrate 10 was peeled off in the vertical direction. Figure 5 shows an example of measurement when connected at a pitch of 5 lines/mm. Solder 12 is lead wire 11
Since the lead wire 11 flows along the direction and protrudes at the ends, the tensile strength is maximum at the ends of the lead wire 11 and shows an averaged minimum value at the center. This situation is shown in Figure 5. In FIG. 5, white circles indicate the maximum intensity, and black circles indicate the minimum intensity. In the conventional full-surface irradiation method, the above-mentioned film elongation occurred, and the connection at a pitch of 2 films/mm was the limit, but according to the present invention, as shown in Fig. 5,
Uniform connections are now possible with a pitch of 1mm/mm. In addition, hydrostatic pressure is applied uniformly to both melted and unmelted areas, and the same hydrostatic pressure is applied to melted areas from the time they begin to melt until they solidify, making the self-alignment effect of the solder effective. It works and provides a reliable connection.

<Effects of the invention> According to the invention, only the connection point is heated locally, and the heating points move sequentially, so the amount of residual heat in the flexible film is significantly reduced, and the amount of residual heat caused by thermal expansion is reduced. Strain and adhesive misalignment between leads and terminals have been eliminated.

In addition, in general, in the sequential connection method using local heating, a stress difference occurs between the connected part and the unconnected part due to the melting and solidification of the solder, and "warping" and "undulation" occur due to uneven stress distribution over the entire surface. However, according to the present invention, the entire surface of the connection part is pressurized with a constant hydrostatic pressure, so even if warping or waviness occurs, the pressurizing force acts evenly, and a reliable connection between the lead and terminal can be obtained. .

In addition, as shown in the conventional full-surface irradiation program in Figure 8, the conventional process required 4 minutes and 10 seconds, but when irradiating all four directions simultaneously with the present invention, there is no need to cool each part of the device. Therefore, the time required for the process is reduced to 2 minutes and 15 seconds. In this way, the process time is shortened, the connected board can be removed immediately after soldering, and the process can be eliminated by eliminating the need for the heating plate, which promotes labor saving and simplification of the process in mass production. Ru.

[Brief explanation of the drawing]

FIG. 1 is a plan view illustrating an embodiment of the present invention. FIG. 2 is a perspective view illustrating the hot ray source feeding means according to the embodiment of the present invention. FIG. 3 is a sectional view of a small infrared spot lamp. FIG. 4 is a diagram illustrating the adhesive force in the connection according to the embodiment of the present invention.
FIG. 5 is a diagram showing an example of measuring adhesive force according to an embodiment of the present invention. FIG. 6 is a half sectional view showing the configuration of a conventional example. FIG. 7 is a half-sectional side view showing the configuration of a conventional example. FIG. 8 shows a program for irradiating heat rays in a conventional connection device. DESCRIPTION OF SYMBOLS 1... Infrared small spot lamp, 2... Drive unit, 3... Feed screw, 4... Guide shaft, 5... Reciprocating table, 6... Relay device, 21... Container, 27...
...Film, 28...Can sealed chamber, 30...Clip, 33...Hard substrate, 34...Flexible substrate.

Claims (1)

[Scope of utility model registration request] A flexible film with multiple connection leads,
A connection device for connecting leads and terminals of a board having a plurality of connection terminals overlapping the leads, wherein the board is superimposed and fixed on the flexible film, and the lower surface of the flexible film is fixed. a fixing and hydrostatic pressurizing jig for applying hydrostatic pressure to the surface; a heat ray source provided above the substrate of the jig for locally concentrating and irradiating heat rays on the connection terminal zone of the lead/terminal; A connecting device comprising: a feeding mechanism for the hot ray source that moves the hot ray source in a direction to enlarge the soldered connection portion while locally irradiating the hot ray onto the connection terminal band.