JPH018981Y2 - - Google Patents
Info
- Publication number
- JPH018981Y2 JPH018981Y2 JP5684583U JP5684583U JPH018981Y2 JP H018981 Y2 JPH018981 Y2 JP H018981Y2 JP 5684583 U JP5684583 U JP 5684583U JP 5684583 U JP5684583 U JP 5684583U JP H018981 Y2 JPH018981 Y2 JP H018981Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- printed circuit
- cement resistor
- circuit board
- lug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004568 cement Substances 0.000 claims description 18
- 230000001419 dependent effect Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000035936 sexual power Effects 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は自立型リードを持つたセメント抵抗の
温度検出装置に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a cement resistance temperature detection device having a self-supporting lead.
従来例の構成とその問題点
従来の温度検出装置は第１図および第２図に示
すように温度依存性素子１のラグ板５を、プリン
ト基板３に接続されたセメント抵抗２のリード６
の中央部にハンダ１０で取付け、温度依存性素子
１のリードをプリント基板３に接続してセメント
抵抗２の温度検出を行なつていた。Configuration of the conventional example and its problems As shown in FIGS.
The temperature of the cement resistor 2 was detected by attaching it to the center of the cement resistor 2 with solder 10, and connecting the leads of the temperature-dependent element 1 to a printed circuit board 3.
しかしこの従来の温度検出装置では、温度依存
性素子１のラグ板５をセメント抵抗２のリード６
の中央部にハンダ１０で接続している為、作業性
が悪く、またハンダ１０にて保持されているので
ハンダ付け不良等によつて外れ落ちる恐れもあ
り、更にはセメント抵抗２が発熱した場合ハンダ
１０が溶けてしまいラグ板５が外れ落ちるという
欠点がある。 However, in this conventional temperature detection device, the lug plate 5 of the temperature dependent element 1 is connected to the lead 6 of the cement resistor 2.
Since it is connected to the center part of the cement resistor 2 with solder 10, workability is poor, and since it is held with solder 10, there is a risk of it falling off due to poor soldering, and furthermore, if the cement resistor 2 generates heat. There is a drawback that the solder 10 melts and the lug plate 5 comes off and falls off.
考案の目的
本考案は上記のような従来の欠点を除去した温
度検出装置を提供するものである。Purpose of the Invention The present invention provides a temperature detection device that eliminates the above-mentioned conventional drawbacks.
考案の構成
本考案は温度依存性素子のラグ板に取付け孔を
設け、セメント抵抗のリードに設けた突起部を上
記ラグ板の取付け孔を介してプリント基板の透孔
へ挿入するとともに、上記リードに設けた当たり
部で上記ラグ板をおさえるようにしたものであ
る。このようにすれば、セメント抵抗とプリント
基板の間に温度依存性素子を簡単に接続してセメ
ント抵抗の温度検出をすることができるから作業
性も改善され、またセメント抵抗に異常電流が流
れて異常発熱をおこした場合にもセメント抵抗の
リードから温度依存性素子が外れ落ちることがな
い。Structure of the invention The present invention provides a mounting hole in the lug plate of the temperature-dependent element, inserts the protrusion provided on the lead of the cement resistor into the through hole of the printed circuit board through the mounting hole of the lug plate, and The above-mentioned lug plate is held down by a contact portion provided on the holder. In this way, it is possible to easily connect a temperature-dependent element between the cement resistor and the printed circuit board to detect the temperature of the cement resistor, which improves work efficiency and prevents abnormal current from flowing through the cement resistor. Even if abnormal heat generation occurs, the temperature-dependent element will not fall off from the lead of the cement resistor.
実施例の説明
以下本考案の一実施例について第３図および第
４図を用いて第１図および第２図に示した従来の
装置と異なる点について説明する。DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 and 4, with respect to the differences from the conventional apparatus shown in FIGS. 1 and 2.
温度依存性素子１のラグ板５の取付け孔９をセ
メント抵抗２のリード６の下端に設けた突起部７
に挿入し、この突起部７をプリント基板３の透孔
にはめ込み、上記リード６に設けた当たり部８で
上記ラグ板５をプリント基板３に向けておさえ
る。さらに熱導通を良くする為に、上記ラグ板５
と上記当たり部８の接触箇所にサーマルコンパウ
ンド４を塗布する。 A protrusion 7 in which the mounting hole 9 of the lug plate 5 of the temperature-dependent element 1 is provided at the lower end of the lead 6 of the cement resistor 2
This protrusion 7 is inserted into the through hole of the printed circuit board 3, and the lug plate 5 is held down toward the printed circuit board 3 by the contact portion 8 provided on the lead 6. In order to further improve heat conduction, the lug plate 5
Thermal compound 4 is applied to the contact area of the contact portion 8.
以上のように温度依存性素子１のラグ板５の取
付け孔９を介してセメント抵抗２のリード６の突
起部７をプリント基板３の透孔にはめ込めば、ハ
ンダ付け作業が不要になり、作業性を向上するこ
とができる。また温度依存性素子１が振動や発熱
によつてリード６から外れ落ちるようなこともな
くなるものである。 As described above, if the protrusion 7 of the lead 6 of the cement resistor 2 is fitted into the through hole of the printed circuit board 3 through the attachment hole 9 of the lug plate 5 of the temperature-dependent element 1, soldering work is no longer necessary. can improve sexual performance. Furthermore, the temperature-dependent element 1 is prevented from falling off the lead 6 due to vibration or heat generation.
考案の効果
以上のように本考案の温度検出装置によれば、
温度依存性素子のハンダ付け作業が不要になつた
為、作業性も向上し、またハンダ付け作業による
不良等もなくなる。またセメント抵抗の発熱によ
りセメント抵抗のリードから温度依存性素子が外
れ落ちることも防止されるため、品質を落すこと
もない。更にリードの当たり部とラグ板の接触箇
所にサーマルコンパウンドを塗布すれば、より確
実に温度の検出が出来るというすぐれた効果が得
られるものである。Effects of the invention As described above, according to the temperature detection device of the invention,
Since soldering work for temperature-dependent elements is no longer necessary, workability is improved and defects caused by soldering work are also eliminated. Furthermore, since the temperature-dependent element is prevented from falling off from the lead of the cement resistor due to the heat generated by the cement resistor, quality is not degraded. Furthermore, if a thermal compound is applied to the contact portion of the lead and the lug plate, an excellent effect can be obtained in that the temperature can be detected more reliably.
第１図は従来の温度検出装置の側面図、第２図
は同正面図、第３図は本考案の一実施例における
温度検出装置の一実施例を示す側面図、第４図は
同正面図である。
１……温度依存性素子、２……セメント抵抗、
３……プリント基板、４……サーマルコンパウン
ド、５……ラグ板、６……リード、７……突起
部、８……当たり部、９……取付け孔。
FIG. 1 is a side view of a conventional temperature detection device, FIG. 2 is a front view of the same, FIG. 3 is a side view of an embodiment of the temperature detection device of the present invention, and FIG. 4 is a front view of the same. It is a diagram. 1...Temperature dependent element, 2...Cement resistance,
3... Printed circuit board, 4... Thermal compound, 5... Lug plate, 6... Lead, 7... Protrusion, 8... Contact part, 9... Mounting hole.
Claims (1)
板の表面に当てて挿入程度を規制する当たり部
とを有する自立型リードを持つセメント抵抗
と、取付け孔を有するラグ板に取付けられた温
度依存性素子を備え、上記セメント抵抗の突起
部を上記ラグ板の取付け孔を介してプリント基
板の透孔へ挿入するとともに上記当たり部で上
記ラグ板をおさえるように構成した温度検出装
置。 (2) 当たり部とラグ板の接続部にサーマルコンパ
ウンドを塗布したことを特徴とする実用新案登
録請求の範囲第１項記載の温度検出装置。[Claims for Utility Model Registration] (1) A cement resistor with a self-supporting lead that has a protrusion that is inserted into a printed circuit board and a contact portion that touches the surface of the printed circuit board to regulate the degree of insertion, and a lug that has a mounting hole. It has a temperature-dependent element attached to the board, and is configured such that the protruding part of the cement resistor is inserted into the through hole of the printed circuit board through the mounting hole of the lug board, and the contact part presses the lug board. Temperature detection device. (2) The temperature detection device according to claim 1 of the utility model registration, characterized in that a thermal compound is applied to the connecting portion between the contact portion and the lug plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5684583U JPS59162634U (en) | 1983-04-15 | 1983-04-15 | temperature detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5684583U JPS59162634U (en) | 1983-04-15 | 1983-04-15 | temperature detection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59162634U JPS59162634U (en) | 1984-10-31 |
| JPH018981Y2 true JPH018981Y2 (en) | 1989-03-10 |
Family
ID=30187163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5684583U Granted JPS59162634U (en) | 1983-04-15 | 1983-04-15 | temperature detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59162634U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4677848B2 (en) * | 2005-08-02 | 2011-04-27 | ダイキン工業株式会社 | Temperature sensor mounting structure for driving integrated circuit |
-
1983
- 1983-04-15 JP JP5684583U patent/JPS59162634U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59162634U (en) | 1984-10-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH018981Y2 (en) | ||
| JP4254725B2 (en) | Mounting structure of printed circuit board and temperature detection element | |
| CN209878145U (en) | Sensing device and infrared sensing mechanism | |
| JPH0646617Y2 (en) | Electric soldering iron | |
| JP2686408B2 (en) | Radiator for module | |
| JP3606672B2 (en) | Chip-type overcurrent protection device | |
| JPS5818200Y2 (en) | socket | |
| JPH0314051Y2 (en) | ||
| JPH0129789Y2 (en) | ||
| JPH0354920Y2 (en) | ||
| JPH0348705Y2 (en) | ||
| JPH0744985Y2 (en) | Thermal element mounting structure | |
| JPH0611457Y2 (en) | Test electrode | |
| JPH0316314Y2 (en) | ||
| JPH0536305Y2 (en) | ||
| JPH10177901A (en) | Electronic part | |
| JPS6134744U (en) | Cooling equipment for electronic equipment | |
| JPS5852687Y2 (en) | Diode mounting device | |
| JPS5846537Y2 (en) | connection device | |
| JPS6120791Y2 (en) | ||
| JP3048757U (en) | Mounting structure of heat sink to substrate | |
| JPS6328608Y2 (en) | ||
| JPS6214701Y2 (en) | ||
| JPH0346505Y2 (en) | ||
| JPS58193537U (en) | Temperature fuse mounting device |