JPH0744985Y2 - Thermal element mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a mounting structure of a heat sensitive element, that is, a structure for mounting a heat sensitive element for temperature detection to various electronic parts.

<Prior Art> When performing an abnormality test of an electronic device, it is necessary to detect the temperature of various electronic components constituting the electronic device in order to prevent overheating. For that purpose, conventionally, a thermosensitive element such as a thermistor is bonded to an electronic component to be temperature-measured by an adhesive such as silicon bond, or both of them are fastened together by a band-shaped metal fitting. The following measures are taken.

<Problems to be solved by the invention> However, in the above-described mounting structure for the heat-sensitive element, not only is it time-consuming to mount the heat-sensitive element and the workability is lowered, but also heat conduction to the heat-sensitive element is covered by the electronic component. There have been inconveniences that the response is lowered by being hindered by the exterior resin or the adhesive, and that the response varies depending on the thickness of the exterior resin or the adhesive.

The present invention has been devised in view of the above circumstances, and provides a mounting structure of a thermosensitive element that can be easily mounted to an electronic component and can obtain a high response. It is an object.

<Means for Solving the Problem> In order to achieve such an object, the mounting structure of the heat-sensitive element according to the present invention has a through-hole formed in the heat-sensitive element through which the lead terminal of the electronic component to be temperature-measured is inserted. The lead terminal is inserted and supported through the through hole.

<Operation> According to the above configuration, the attachment of the thermosensitive element is completed simply by inserting the lead terminal of the electronic component to be temperature-measured into the through hole of the thermosensitive element. Then, the heat of the electronic component is directly transferred to the heat sensitive element attached to the electronic component through the lead terminals without any time difference.

<Embodiment> An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a mounting structure of a heat-sensitive element according to the present invention, and FIG. 2 is a partially longitudinal side view thereof. Further, reference numeral 1 in these drawings is an electronic component with a lead terminal which is a temperature detection target for detecting the temperature, and 2 is a thermosensitive element such as a thermistor attached thereto.

The thermosensitive element 2 includes a ceramic body 3 formed in a prismatic shape, and external electrodes 4, 4 formed by printing and firing silver paste or the like are formed on both surfaces of the ceramic body 3 facing each other. There is. A lead terminal 5 is attached to each external electrode 4 by soldering or the like.

Further, the ceramic body 3 is formed with a through hole 7 into which the lead terminal 6 protruding from the electronic component 1 is inserted, and the entire outer circumference thereof is covered with an exterior resin 8. It should be noted that the shape of the ceramic body 3 is not limited to the prismatic shape, and may be formed in any other arbitrary shape such as a cylindrical shape.

Therefore, the thermosensitive element 2 is inserted into and supported by the lead terminal 6 of the electronic component 1 to be temperature-measured through the through hole 7 formed in the ceramic body 3.

<Effects of the Invention> As described above, in the present invention, the thermosensitive element is formed with a through hole through which the lead terminal of the electronic component to be temperature-detected is inserted, and the lead terminal is inserted through the through hole. Since it is inserted and supported, the attachment of the heat-sensitive element is completed simply by inserting the lead terminal of the electronic component into the through hole of the heat-sensitive element. Then, the heat of the electronic component is directly transferred to the heat sensitive element attached to the electronic component through the lead terminals without any time difference.

Therefore, according to the present invention, as compared with the conventional structure such as bonding or joint fastening with metal fittings, the mounting work of the heat sensitive element is extremely easy and easy, and the heat of the electronic component does not involve the exterior resin or the adhesive. Since it is directly transmitted to the lead terminal, a high response can be obtained. In addition, the response no longer fluctuates due to differences in the thickness of the exterior resin and adhesive.

[Brief description of drawings]

FIG. 1 is a perspective view showing a mounting structure of a heat-sensitive element according to the present invention, and FIG. 2 is a partially longitudinal side view thereof. In the figure, reference numeral 1 is an electronic component, 2 is a heat sensitive element, 6 is a lead terminal, and 7 is a through hole.

Claims (1)

[Scope of utility model registration request] 1. A heat-sensitive element, wherein a through-hole through which a lead terminal of an electronic component to be temperature-measured is inserted is formed in the heat-sensitive element, and the lead terminal is inserted and supported through the through-hole. Mounting structure.