JPH0186317U - - Google Patents
Info
- Publication number
- JPH0186317U JPH0186317U JP17880487U JP17880487U JPH0186317U JP H0186317 U JPH0186317 U JP H0186317U JP 17880487 U JP17880487 U JP 17880487U JP 17880487 U JP17880487 U JP 17880487U JP H0186317 U JPH0186317 U JP H0186317U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- delay medium
- delay
- wiring pattern
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000005022 packaging material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Description
第１図〜第３図は本考案の実施例を示し、第１
図は本考案による超音波遅延線の分解斜視図であ
り、第２図は超音波遅延線の断面図であり、第３
図はリード線接続部の拡大斜視図であり、第４図
は従来の超音波遅延線の斜視図である。
１……遅延媒体、２……トランスデユーサ、３
……リード線、４……絶縁基板、６……包装材。
Figures 1 to 3 show embodiments of the present invention;
The figure is an exploded perspective view of the ultrasonic delay line according to the present invention, FIG. 2 is a sectional view of the ultrasonic delay line, and FIG.
The figure is an enlarged perspective view of a lead wire connection part, and FIG. 4 is a perspective view of a conventional ultrasonic delay line. 1... Delay medium, 2... Transducer, 3
... Lead wire, 4 ... Insulating board, 6 ... Packaging material.
Claims (1)
形形状とほぼ同じ形状の開口部を有する枠状体の
絶縁基板に、少なくとも１端面にトランスデユー
サを設けた遅延媒体を、トランスデユーサの電極
と前記配線パターンとが導電接続可能なように嵌
め込み、前記絶縁基板と遅延媒体の両側面の全部
あるいは１部を包装材により包装して遅延媒体を
絶縁基板に固定したこと特徴とする超音波遅延線
。 A delay medium having a transducer provided on at least one end surface is attached to an insulating substrate in the form of a frame having a wiring pattern printed thereon and an opening having approximately the same external shape as the delay medium. An ultrasonic delay line characterized in that the delay medium is fixed to the insulating substrate by being fitted into the wiring pattern so as to be conductively connected to the insulating substrate, and wrapping all or part of both sides of the insulating substrate and the delay medium with a packaging material.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17880487U JPH0537540Y2 (en) | 1987-11-26 | 1987-11-26 | |
| DE3839867A DE3839867A1 (en) | 1987-11-26 | 1988-11-25 | ULTRASONIC DELAY LINE |
| CN88108141A CN1011457B (en) | 1987-11-26 | 1988-11-25 | Ultrasonic delay line |
| GB8827567A GB2213012B (en) | 1987-11-26 | 1988-11-25 | Ultrasonic delay line |
| KR1019880015628A KR890008906A (en) | 1987-11-26 | 1988-11-26 | Ultrasonic delay line |
| US07/653,751 US5130679A (en) | 1987-11-26 | 1991-02-11 | Ultrasonic delay line mounted in a frame-like body having a wiring pattern thereon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17880487U JPH0537540Y2 (en) | 1987-11-26 | 1987-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0186317U true JPH0186317U (en) | 1989-06-07 |
| JPH0537540Y2 JPH0537540Y2 (en) | 1993-09-22 |
Family
ID=31470403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17880487U Expired - Lifetime JPH0537540Y2 (en) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537540Y2 (en) |
-
1987
- 1987-11-26 JP JP17880487U patent/JPH0537540Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537540Y2 (en) | 1993-09-22 |