JPH0221752U - - Google Patents
Info
- Publication number
- JPH0221752U JPH0221752U JP10094588U JP10094588U JPH0221752U JP H0221752 U JPH0221752 U JP H0221752U JP 10094588 U JP10094588 U JP 10094588U JP 10094588 U JP10094588 U JP 10094588U JP H0221752 U JPH0221752 U JP H0221752U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor device
- view
- output side
- input side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案による半導体装置の実装状態を
示す断面図、第２図は第１図の斜視図、第３図は
従来の半導体装置の実装状態を示す断面図、第４
図は従来の半導体装置の実装状態を示す斜視図で
ある。
１０１，２０１，３０１，４０１……シヤーシ
、１０２，２０２，３０２，４０２……入力側基
板、１０３，２０３，３０３，４０３……出力側
基板、１０４，２０４，３０４，４０４……入力
側ストリツプライン、１０５，２０５，３０５，
４０５……出力側ストリツプライン、１０６，２
０６，３０６，４０６……入力側半田付け部、１
０７，２０７，３０７，４０７……出力側半田付
け部、１０８，２０８，３０８，４０８……半導
体装置、１０９，２０９，３０９，４０９……入
力側リード、１１０，２１０，３１０，４１０…
…出力側リード、１１１，３１１……入力側リー
ド緩衝部、１１２，２１２，３１２，４１２……
出力側リード緩衝部。
FIG. 1 is a sectional view showing a mounted state of a semiconductor device according to the present invention, FIG. 2 is a perspective view of FIG. 1, FIG. 3 is a sectional view showing a conventional semiconductor device mounted state, and FIG.
The figure is a perspective view showing a state in which a conventional semiconductor device is mounted. 101,201,301,401... Chassis, 102,202,302,402... Input side board, 103,203,303,403... Output side board, 104,204,304,404... Input side strip Prine, 105, 205, 305,
405...Output side stripline, 106,2
06,306,406...Input side soldering part, 1
07,207,307,407...Output side soldering part, 108,208,308,408...Semiconductor device, 109,209,309,409...Input side lead, 110,210,310,410...
...Output side lead, 111,311...Input side lead buffer, 112,212,312,412...
Output side lead buffer.
Claims (1)
置において、該リードの一部を円筒状に形成した
ことを特徴とする半導体装置。 1. A semiconductor device having a lead made of a metal material, wherein a part of the lead is formed into a cylindrical shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094588U JPH0221752U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10094588U JPH0221752U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221752U true JPH0221752U (en) | 1990-02-14 |
Family
ID=31329486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10094588U Pending JPH0221752U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221752U (en) |
-
1988
- 1988-07-28 JP JP10094588U patent/JPH0221752U/ja active Pending