JPS63157481U - - Google Patents

Info

Publication number
JPS63157481U
JPS63157481U JP4916087U JP4916087U JPS63157481U JP S63157481 U JPS63157481 U JP S63157481U JP 4916087 U JP4916087 U JP 4916087U JP 4916087 U JP4916087 U JP 4916087U JP S63157481 U JPS63157481 U JP S63157481U
Authority
JP
Japan
Prior art keywords
recess
tip
stirring rod
protrusion
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4916087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4916087U priority Critical patent/JPS63157481U/ja
Publication of JPS63157481U publication Critical patent/JPS63157481U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,bは、本考案に係る半田攪拌棒を示
すもので、その使用態様の要部のみの断面図、第
2図は、従来の半田攪拌棒を示すもので、その使
用態様の断面図である。 11……半田攪拌棒、13……凹部、14……
突出部。
Figures 1a and b show a solder stirring rod according to the present invention, and are cross-sectional views of only the main parts of how it is used, and Figure 2 shows a conventional solder stirring rod, showing how it is used. FIG. 11...Solder stirring bar, 13...Concave portion, 14...
protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 先端に凹部を形成し、この凹部中央に、先端よ
りも突出しない突出部を形成したことを特徴とす
る半田攪拌棒。
A solder stirring rod characterized in that a recess is formed at the tip, and a protrusion that does not protrude beyond the tip is formed in the center of the recess.
JP4916087U 1987-03-31 1987-03-31 Pending JPS63157481U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4916087U JPS63157481U (en) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4916087U JPS63157481U (en) 1987-03-31 1987-03-31

Publications (1)

Publication Number Publication Date
JPS63157481U true JPS63157481U (en) 1988-10-14

Family

ID=30871353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4916087U Pending JPS63157481U (en) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPS63157481U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210953A (en) * 2010-03-30 2011-10-20 Fujitsu Ltd Flux pin, device for transferring flux, and method of transferring the flux
JP2012074565A (en) * 2010-09-29 2012-04-12 Diamond Electric Mfg Co Ltd Ultrasonic junction tool, ultrasonic junction device and junction material pattern formation method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210953A (en) * 2010-03-30 2011-10-20 Fujitsu Ltd Flux pin, device for transferring flux, and method of transferring the flux
JP2012074565A (en) * 2010-09-29 2012-04-12 Diamond Electric Mfg Co Ltd Ultrasonic junction tool, ultrasonic junction device and junction material pattern formation method

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