JPH0183333U - - Google Patents
Info
- Publication number
- JPH0183333U JPH0183333U JP17998387U JP17998387U JPH0183333U JP H0183333 U JPH0183333 U JP H0183333U JP 17998387 U JP17998387 U JP 17998387U JP 17998387 U JP17998387 U JP 17998387U JP H0183333 U JPH0183333 U JP H0183333U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- insulating substrate
- conductor
- integrated circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Die Bonding (AREA)
Description
第1図および第2図は本考案の平面図、第3図
は従来技術の平面図である。 1,1′,1″……マウントランド、2,2′
……分離されたメツキ引き出し、3,3′,3″
……ボンデイングランド、4,4′,4″……絶
縁基板。
は従来技術の平面図である。 1,1′,1″……マウントランド、2,2′
……分離されたメツキ引き出し、3,3′,3″
……ボンデイングランド、4,4′,4″……絶
縁基板。
Claims (1)
- 絶縁基板上にメツキ等により導体を形成する混
成集積回路基板に於いて、マウントランドと分離
されたメツキ引き出しパターンを設けたことを特
徴とする混成集積回路用配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17998387U JPH0183333U (ja) | 1987-11-25 | 1987-11-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17998387U JPH0183333U (ja) | 1987-11-25 | 1987-11-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0183333U true JPH0183333U (ja) | 1989-06-02 |
Family
ID=31471523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17998387U Pending JPH0183333U (ja) | 1987-11-25 | 1987-11-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0183333U (ja) |
-
1987
- 1987-11-25 JP JP17998387U patent/JPH0183333U/ja active Pending