JPH0175294U - - Google Patents
Info
- Publication number
- JPH0175294U JPH0175294U JP17121987U JP17121987U JPH0175294U JP H0175294 U JPH0175294 U JP H0175294U JP 17121987 U JP17121987 U JP 17121987U JP 17121987 U JP17121987 U JP 17121987U JP H0175294 U JPH0175294 U JP H0175294U
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- plate
- transparent
- light emitting
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17121987U JPH0175294U (US20030199744A1-20031023-C00003.png) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17121987U JPH0175294U (US20030199744A1-20031023-C00003.png) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0175294U true JPH0175294U (US20030199744A1-20031023-C00003.png) | 1989-05-22 |
Family
ID=31462856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17121987U Pending JPH0175294U (US20030199744A1-20031023-C00003.png) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0175294U (US20030199744A1-20031023-C00003.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532298A (ja) * | 2005-02-28 | 2008-08-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Ｌｅｄアレイ |
| JP2009010204A (ja) * | 2007-06-28 | 2009-01-15 | Nichia Corp | 発光装置 |
| WO2010074028A1 (ja) * | 2008-12-22 | 2010-07-01 | パナソニック電工株式会社 | 発光装置 |
| JP2016157979A (ja) * | 2010-09-13 | 2016-09-01 | 東芝ホクト電子株式会社 | 発光装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567179A (en) * | 1978-11-14 | 1980-05-21 | Matsushita Electric Ind Co Ltd | Luminous display device |
| JPS5692577A (en) * | 1979-12-26 | 1981-07-27 | Fujitsu Ltd | Lighttemittinggdiode display panel |
-
1987
- 1987-11-09 JP JP17121987U patent/JPH0175294U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567179A (en) * | 1978-11-14 | 1980-05-21 | Matsushita Electric Ind Co Ltd | Luminous display device |
| JPS5692577A (en) * | 1979-12-26 | 1981-07-27 | Fujitsu Ltd | Lighttemittinggdiode display panel |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532298A (ja) * | 2005-02-28 | 2008-08-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Ｌｅｄアレイ |
| JP2009010204A (ja) * | 2007-06-28 | 2009-01-15 | Nichia Corp | 発光装置 |
| WO2010074028A1 (ja) * | 2008-12-22 | 2010-07-01 | パナソニック電工株式会社 | 発光装置 |
| US8410471B2 (en) | 2008-12-22 | 2013-04-02 | Panasonic Corporation | Light emitting device |
| JP2016157979A (ja) * | 2010-09-13 | 2016-09-01 | 東芝ホクト電子株式会社 | 発光装置 |
