JPH0173931U - - Google Patents
Info
- Publication number
- JPH0173931U JPH0173931U JP1987169556U JP16955687U JPH0173931U JP H0173931 U JPH0173931 U JP H0173931U JP 1987169556 U JP1987169556 U JP 1987169556U JP 16955687 U JP16955687 U JP 16955687U JP H0173931 U JPH0173931 U JP H0173931U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- metal
- soldering
- semiconductor
- main surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169556U JPH0173931U (en:Method) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169556U JPH0173931U (en:Method) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173931U true JPH0173931U (en:Method) | 1989-05-18 |
Family
ID=31459726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169556U Pending JPH0173931U (en:Method) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173931U (en:Method) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57107041A (en) * | 1980-12-25 | 1982-07-03 | Nec Corp | Semiconductor device |
-
1987
- 1987-11-05 JP JP1987169556U patent/JPH0173931U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57107041A (en) * | 1980-12-25 | 1982-07-03 | Nec Corp | Semiconductor device |