JPH0167775U - - Google Patents
Info
- Publication number
- JPH0167775U JPH0167775U JP1987162249U JP16224987U JPH0167775U JP H0167775 U JPH0167775 U JP H0167775U JP 1987162249 U JP1987162249 U JP 1987162249U JP 16224987 U JP16224987 U JP 16224987U JP H0167775 U JPH0167775 U JP H0167775U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- hole
- conductive layer
- solder
- ground connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例を示す縦断側面図
、第２図は従来例を示す縦断側面図である。
１……貫通型コンデンサ（電子部品）、２……
本体部、３……リード線、４……アース接続部、
５……絶縁基板、６，７……導電層、８……スル
ーホール、９，１０……半田接続孔、１３……半
田。
FIG. 1 is a vertical side view showing an embodiment of this invention, and FIG. 2 is a vertical side view showing a conventional example. 1...Feedthrough capacitor (electronic component), 2...
Main body, 3...Lead wire, 4...Earth connection part,
5... Insulating substrate, 6, 7... Conductive layer, 8... Through hole, 9, 10... Solder connection hole, 13... Solder.
Claims (1)
部の外周面に形成されたアース接続部とを有する
電子部品を設け、回路に接続された導電層が形成
された絶縁基板を設け、前記リード線の両端部を
互いに方向を揃えて前記絶縁基板の一方の面から
他方の面に突出させる半田接続孔を前記絶縁基板
と前記導電層とに形成し、前記半田接続孔に溶着
された半田により前記リード線を前記導電層に接
続し、前記絶縁基板に前記アース接続部に対向す
るスルーホールを形成してこのスルーホールに溶
着された半田を介して前記アース接続部を接地し
たことを特徴とする電子機器の回路基板。 An electronic component having lead wires protruding from both ends of a main body portion and a ground connection portion formed on the outer peripheral surface of the main body portion is provided, an insulating substrate on which a conductive layer connected to a circuit is formed, and the lead wire A solder connection hole is formed in the insulating substrate and the conductive layer to project from one surface of the insulating substrate to the other surface with both ends thereof aligned in the same direction, and the solder welded to the solder connection hole causes the A lead wire is connected to the conductive layer, a through hole is formed in the insulating substrate facing the ground connection part, and the ground connection part is grounded via solder welded to the through hole. Circuit board for electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162249U JPH0167775U (en) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162249U JPH0167775U (en) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167775U true JPH0167775U (en) | 1989-05-01 |
Family
ID=31445905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162249U Pending JPH0167775U (en) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167775U (en) |
-
1987
- 1987-10-23 JP JP1987162249U patent/JPH0167775U/ja active Pending
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