JPH0167761U - - Google Patents
Info
- Publication number
- JPH0167761U JPH0167761U JP1987163318U JP16331887U JPH0167761U JP H0167761 U JPH0167761 U JP H0167761U JP 1987163318 U JP1987163318 U JP 1987163318U JP 16331887 U JP16331887 U JP 16331887U JP H0167761 U JPH0167761 U JP H0167761U
- Authority
- JP
- Japan
- Prior art keywords
- blow
- prevention member
- out prevention
- substrate
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 8
- 230000002265 prevention Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163318U JPH0167761U (en, 2012) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163318U JPH0167761U (en, 2012) | 1987-10-26 | 1987-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167761U true JPH0167761U (en, 2012) | 1989-05-01 |
Family
ID=31447938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987163318U Pending JPH0167761U (en, 2012) | 1987-10-26 | 1987-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167761U (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010084540A1 (ja) * | 2009-01-20 | 2010-07-29 | パナソニック株式会社 | 回路基板、回路モジュール、及び回路モジュールを備えた電子機器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118640A (en) * | 1979-03-06 | 1980-09-11 | Nec Corp | Manufacture of semiconductor device |
| JPS5828841A (ja) * | 1981-08-14 | 1983-02-19 | Toshiba Corp | 樹脂封止型半導体装置の製造方法 |
| JPS59211237A (ja) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | 樹脂モ−ルド装置 |
-
1987
- 1987-10-26 JP JP1987163318U patent/JPH0167761U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118640A (en) * | 1979-03-06 | 1980-09-11 | Nec Corp | Manufacture of semiconductor device |
| JPS5828841A (ja) * | 1981-08-14 | 1983-02-19 | Toshiba Corp | 樹脂封止型半導体装置の製造方法 |
| JPS59211237A (ja) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | 樹脂モ−ルド装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010084540A1 (ja) * | 2009-01-20 | 2010-07-29 | パナソニック株式会社 | 回路基板、回路モジュール、及び回路モジュールを備えた電子機器 |
| JP2010171082A (ja) * | 2009-01-20 | 2010-08-05 | Panasonic Corp | 回路モジュール及び電子機器 |