JPH0167761U - - Google Patents
Info
- Publication number
- JPH0167761U JPH0167761U JP1987163318U JP16331887U JPH0167761U JP H0167761 U JPH0167761 U JP H0167761U JP 1987163318 U JP1987163318 U JP 1987163318U JP 16331887 U JP16331887 U JP 16331887U JP H0167761 U JPH0167761 U JP H0167761U
- Authority
- JP
- Japan
- Prior art keywords
- blow
- prevention member
- out prevention
- substrate
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 8
- 230000002265 prevention Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案の第１実施例に於ける基板
に吹出防止部材を固着した斜視図である。第２図
は、第１図に示す基板を封止樹脂によつて封止し
たものの断面図である。第３図は、第２図に示す
ものの斜視図である。第４図は、この考案の第２
実施例を示した断面図である。第５図は、この考
案の第３実施例を示した斜視図である。第６図は
、第５図に示すものを装置に取付けた断面図であ
る。
１……基板、２……吹出防止部材、３……封止
樹脂、６……金型、７……フラツトワイヤ、８…
…メンブレンスイツチ、１３……スルホール、１
２ａ……タツチスイツチ電極。
FIG. 1 is a perspective view of a blow-out prevention member fixed to a substrate in a first embodiment of this invention. FIG. 2 is a sectional view of the substrate shown in FIG. 1 sealed with a sealing resin. FIG. 3 is a perspective view of what is shown in FIG. 2. Figure 4 shows the second version of this idea.
It is a sectional view showing an example. FIG. 5 is a perspective view showing a third embodiment of this invention. FIG. 6 is a sectional view of the device shown in FIG. 5 attached to the device. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Blowout prevention member, 3... Sealing resin, 6... Mold, 7... Flat wire, 8...
...Membrane switch, 13...Through hole, 1
2a...Touch switch electrode.
Claims (1)
により封止する封止樹脂とからなる封止素子に於
いて、前記封止樹脂の吹出防止部材を少なくとも
基板又は金型いずれか一方に固着したことを特徴
とする封止素子の吹出防止部材。 (2) 前記吹出防止部材は耐熱ゴムからなること
を特徴とする実用新案登録請求の範囲第１項記載
の封止素子の吹出防止部材。[Claims for Utility Model Registration] (1) In a sealing element consisting of a circuit-formed substrate and a sealing resin for sealing the substrate with a molding die, a blow-out prevention member of the sealing resin is provided. A blow-out prevention member for a sealing element, characterized in that it is fixed to at least either a substrate or a mold. (2) The blow-out prevention member for a sealing element according to claim 1, wherein the blow-out prevention member is made of heat-resistant rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163318U JPH0167761U (en) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163318U JPH0167761U (en) | 1987-10-26 | 1987-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167761U true JPH0167761U (en) | 1989-05-01 |
Family
ID=31447938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987163318U Pending JPH0167761U (en) | 1987-10-26 | 1987-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167761U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4489137B1 (en) * | 2009-01-20 | 2010-06-23 | パナソニック株式会社 | Circuit module and electronic device |
-
1987
- 1987-10-26 JP JP1987163318U patent/JPH0167761U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4489137B1 (en) * | 2009-01-20 | 2010-06-23 | パナソニック株式会社 | Circuit module and electronic device |
| WO2010084540A1 (en) * | 2009-01-20 | 2010-07-29 | パナソニック株式会社 | Circuit board, circuit module, and electronic device provided with circuit module |
| JP2010171082A (en) * | 2009-01-20 | 2010-08-05 | Panasonic Corp | Circuit module and electronic equipment |