JPH01146625U - - Google Patents

Info

Publication number
JPH01146625U
JPH01146625U JP4216788U JP4216788U JPH01146625U JP H01146625 U JPH01146625 U JP H01146625U JP 4216788 U JP4216788 U JP 4216788U JP 4216788 U JP4216788 U JP 4216788U JP H01146625 U JPH01146625 U JP H01146625U
Authority
JP
Japan
Prior art keywords
electronic component
cap
component element
stem
seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4216788U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4216788U priority Critical patent/JPH01146625U/ja
Publication of JPH01146625U publication Critical patent/JPH01146625U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の実施例である電子部品のシ
ール構造を表す縦断面図、第2図は同電子部品の
シール構造を表す分解斜視図である。第3図は従
来の電子部品のシール構造を表す縦断面図であり
、第4図はそのキヤツプの部分拡大断面図である
。 1―電子部品素子、2―ステム、3―キヤツプ
FIG. 1 is a longitudinal cross-sectional view showing a sealing structure of an electronic component according to an embodiment of this invention, and FIG. 2 is an exploded perspective view showing the sealing structure of the same electronic component. FIG. 3 is a vertical cross-sectional view showing a conventional sealing structure of an electronic component, and FIG. 4 is a partially enlarged cross-sectional view of its cap. 1-electronic component element, 2-stem, 3-cap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品素子が設置されるステム上にキヤツプ
が取り付けられて、電子部品素子設置部が密封さ
れるシール構造において、前記キヤツプを導電性
樹脂の成型体より構成したことを特徴とする電子
部品のシール構造。
A seal for an electronic component, characterized in that a cap is attached to a stem on which an electronic component element is installed, and the electronic component element installation part is hermetically sealed, wherein the cap is made of a molded body of conductive resin. structure.
JP4216788U 1988-03-30 1988-03-30 Pending JPH01146625U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4216788U JPH01146625U (en) 1988-03-30 1988-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4216788U JPH01146625U (en) 1988-03-30 1988-03-30

Publications (1)

Publication Number Publication Date
JPH01146625U true JPH01146625U (en) 1989-10-09

Family

ID=31268589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4216788U Pending JPH01146625U (en) 1988-03-30 1988-03-30

Country Status (1)

Country Link
JP (1) JPH01146625U (en)

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