JPH01128139U - - Google Patents
Info
- Publication number
- JPH01128139U JPH01128139U JP2525388U JP2525388U JPH01128139U JP H01128139 U JPH01128139 U JP H01128139U JP 2525388 U JP2525388 U JP 2525388U JP 2525388 U JP2525388 U JP 2525388U JP H01128139 U JPH01128139 U JP H01128139U
- Authority
- JP
- Japan
- Prior art keywords
- case
- terminal body
- terminal
- sensing element
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004382 potting Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図は本考案の実施例を示す縦断面図、第２
図は従来例の要部断面図である。
符号の説明、１……ケース、２……感温素子、
３……ターミナル、４……導体、５……ポツテイ
ング層、６……端部、１０……ターミナルボデイ
、１６……シール部材。
Fig. 1 is a vertical sectional view showing an embodiment of the present invention;
The figure is a sectional view of a main part of a conventional example. Explanation of symbols, 1... Case, 2... Temperature sensing element,
3...Terminal, 4...Conductor, 5...Potting layer, 6...End portion, 10...Terminal body, 16...Sealing member.
Claims (1)
を、他端に金属製のターミナルをそれぞれ取付け
た導体と、感温素子の周囲を絶縁するようにケー
ス内に充填されたポツテイング層と、ターミナル
の周囲に一体成形され、シール部材を介してケー
スの開口部へ嵌合される樹脂製のターミナルボデ
イとを備えた高温センサにおいて、該ターミナル
ボデイの前記ケース内にある端部と前記ポツテイ
ング層の端部とをオーバーラツプさせたことを特
徴とする高温センサ。 A case, a conductor housed inside the case and having a temperature sensing element attached to one end and a metal terminal attached to the other end, a potting layer filled in the case to insulate the area around the temperature sensing element, and a terminal. A high temperature sensor comprising a resin terminal body integrally molded around the periphery of the terminal body and fitted into the opening of the case through a sealing member, the end of the terminal body inside the case and the potting layer. A high temperature sensor characterized by overlapping the ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2525388U JPH01128139U (en) | 1988-02-26 | 1988-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2525388U JPH01128139U (en) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01128139U true JPH01128139U (en) | 1989-09-01 |
Family
ID=31245829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2525388U Pending JPH01128139U (en) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01128139U (en) |
-
1988
- 1988-02-26 JP JP2525388U patent/JPH01128139U/ja active Pending