JPH0165138U - - Google Patents

Info

Publication number
JPH0165138U
JPH0165138U JP1987160138U JP16013887U JPH0165138U JP H0165138 U JPH0165138 U JP H0165138U JP 1987160138 U JP1987160138 U JP 1987160138U JP 16013887 U JP16013887 U JP 16013887U JP H0165138 U JPH0165138 U JP H0165138U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit boards
fixing
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987160138U
Other languages
Japanese (ja)
Other versions
JPH0442939Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987160138U priority Critical patent/JPH0442939Y2/ja
Publication of JPH0165138U publication Critical patent/JPH0165138U/ja
Application granted granted Critical
Publication of JPH0442939Y2 publication Critical patent/JPH0442939Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示す斜視図、第２図
は第１図の―断面図、第３図は従来例を示す
断面図である。 １，２は混成集積回路基板、３，４は第１、第
２の外部リード、５はケース材、６は混成集積回
路離間部材。 FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line shown in FIG. 1, and FIG. 3 is a cross-sectional view showing a conventional example. 1 and 2 are hybrid integrated circuit boards, 3 and 4 are first and second external leads, 5 is a case material, and 6 is a hybrid integrated circuit spacing member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 二枚の混成集積回路基板と、前記二枚の混成集
積回路基板の少なくとも一側辺から導出され直角
に折曲げられた外部リードと、前記二枚の混成集
積回路基板を離間固着するケース材とを備えた混
成集積回路において、前記外部リードを強制的に
位置規制するための規制板と前記規制板と一体形
成され前記混成集積回路を挿入したとき固定する
ガイド部とを有する混成集積回路離間部材を前記
混成集積回路と一体化させ前記混成集積回路の取
付け面とマザー配線板間に所定の空間部を設ける
ことを特徴とする混成集積回路。 two hybrid integrated circuit boards, an external lead led out from at least one side of the two hybrid integrated circuit boards and bent at a right angle, and a case material for fixing the two hybrid integrated circuit boards apart from each other; A hybrid integrated circuit spacing member comprising: a regulating plate for forcibly regulating the position of the external lead; and a guide portion formed integrally with the regulating plate and fixing the hybrid integrated circuit when inserted. is integrated with the hybrid integrated circuit, and a predetermined space is provided between a mounting surface of the hybrid integrated circuit and a mother wiring board.
JP1987160138U 1987-10-20 1987-10-20 Expired JPH0442939Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987160138U JPH0442939Y2 (en) 1987-10-20 1987-10-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987160138U JPH0442939Y2 (en) 1987-10-20 1987-10-20

Publications (2)

Publication Number Publication Date
JPH0165138U true JPH0165138U (en) 1989-04-26
JPH0442939Y2 JPH0442939Y2 (en) 1992-10-12

Family

ID=31441943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987160138U Expired JPH0442939Y2 (en) 1987-10-20 1987-10-20

Country Status (1)

Country Link
JP (1) JPH0442939Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113475U (en) * 1991-03-22 1992-10-05 富士ゼロツクス株式会社 Hybrid IC

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113475U (en) * 1991-03-22 1992-10-05 富士ゼロツクス株式会社 Hybrid IC

Also Published As

Publication number Publication date
JPH0442939Y2 (en) 1992-10-12

Similar Documents

Publication Publication Date Title
JPH0165138U (en)
JPS60160021U (en) Fixing device for electrical harness
JPS63178374U (en)
JPS6344457U (en)
JPH049983U (en)
JPH0639486Y2 (en) Case structure
JPS63149566U (en)
JPS59132181U (en) Terminal block mounting device
JPH0399463U (en)
JPS6228446U (en)
JPH0241474U (en)
JPS63108675U (en)
JPS6112244U (en) Mounting structure of packaged electronic components
JPS6040987U (en) connector device
JPS63469U (en)
JPH0268496U (en)
JPS5860991U (en) Support device for wiring boards, etc.
JPS6454268U (en)
JPS5942049U (en) Electronic component mounting structure
JPS5920666U (en) printed wiring board structure
JPS59173385U (en) Air conditioner electrical component mounting device
JPH0275765U (en)
JPS59171350U (en) Semiconductor element mounting structure
JPS6190273U (en)
JPH0265353U (en)