JPH0163168U - - Google Patents
Info
- Publication number
- JPH0163168U JPH0163168U JP1987157504U JP15750487U JPH0163168U JP H0163168 U JPH0163168 U JP H0163168U JP 1987157504 U JP1987157504 U JP 1987157504U JP 15750487 U JP15750487 U JP 15750487U JP H0163168 U JPH0163168 U JP H0163168U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- electronic component
- printed wiring
- wiring board
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案に係るプリント配線板の一部
省略斜視図、第２図は、第１図におけるＸ部拡大
図、第３図は、第２図におけるＡ―Ａ線矢視断面
図、第４図は、従来のパツドを説明する図、第５
図は、第４図におけるＢ―Ｂ線矢視断面図、第６
図は、パツドの位置ズレを説明する図である。
１…プリント配線板、２…基板、３…導体、４
…電子部品接続部分、４ａ…外周縁、５…半田レ
ジスト、６…パツド。
1 is a partially omitted perspective view of a printed wiring board according to the present invention, FIG. 2 is an enlarged view of the X part in FIG. 1, and FIG. 3 is a sectional view taken along the line A--A in FIG. 2. , Figure 4 is a diagram explaining the conventional pad, and Figure 5 is a diagram explaining the conventional pad.
The figure is a sectional view taken along line B-B in Figure 4, and
The figure is a diagram illustrating the positional shift of the pad. 1...Printed wiring board, 2...Substrate, 3...Conductor, 4
...Electronic component connection portion, 4a...outer periphery, 5...solder resist, 6...pad.
Claims (1)
分を残して半田レジストで被覆してパツドを形成
するプリント配線板であつて、 前記電子部品接続部分を多角平板状に成し、該
電子部品接続部分の外周縁を半田レジストにて覆
つて略円形状のパツドを形成したプリント配線板
の構造。[Claims for Utility Model Registration] A printed wiring board in which a conductor is provided on a board, and a pad is formed by covering the conductor with a solder resist, leaving the electronic component connection portion of the conductor, the electronic component connection portion being a polygonal flat plate. A structure of a printed wiring board in which the outer periphery of the electronic component connecting portion is covered with a solder resist to form a substantially circular pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157504U JPH0163168U (en) | 1987-10-16 | 1987-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987157504U JPH0163168U (en) | 1987-10-16 | 1987-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163168U true JPH0163168U (en) | 1989-04-24 |
Family
ID=31437007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987157504U Pending JPH0163168U (en) | 1987-10-16 | 1987-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163168U (en) |
-
1987
- 1987-10-16 JP JP1987157504U patent/JPH0163168U/ja active Pending