JPH0160813B2 - - Google Patents
Info
- Publication number
- JPH0160813B2 JPH0160813B2 JP57202209A JP20220982A JPH0160813B2 JP H0160813 B2 JPH0160813 B2 JP H0160813B2 JP 57202209 A JP57202209 A JP 57202209A JP 20220982 A JP20220982 A JP 20220982A JP H0160813 B2 JPH0160813 B2 JP H0160813B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- photoresist
- layer
- dye
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 29
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 10
- 238000000206 photolithography Methods 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 6
- YCUVUDODLRLVIC-VPHDGDOJSA-N sudan black b Chemical compound C1=CC(=C23)NC(C)(C)NC2=CC=CC3=C1\N=N\C(C1=CC=CC=C11)=CC=C1\N=N\C1=CC=CC=C1 YCUVUDODLRLVIC-VPHDGDOJSA-N 0.000 claims description 6
- IICHURGZQPGTRD-UHFFFAOYSA-N 4-phenyldiazenylnaphthalen-1-amine Chemical compound C12=CC=CC=C2C(N)=CC=C1N=NC1=CC=CC=C1 IICHURGZQPGTRD-UHFFFAOYSA-N 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 49
- 238000000576 coating method Methods 0.000 description 36
- 239000011248 coating agent Substances 0.000 description 33
- 239000000975 dye Substances 0.000 description 25
- 230000002745 absorbent Effects 0.000 description 12
- 239000002250 absorbent Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 230000008021 deposition Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- XXTZHYXQVWRADW-UHFFFAOYSA-N diazomethanone Chemical compound [N]N=C=O XXTZHYXQVWRADW-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US352929 | 1982-02-26 | ||
| US06/352,929 US4414314A (en) | 1982-02-26 | 1982-02-26 | Resolution in optical lithography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58149045A JPS58149045A (ja) | 1983-09-05 |
| JPH0160813B2 true JPH0160813B2 (US06582424-20030624-M00016.png) | 1989-12-26 |
Family
ID=23387052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57202209A Granted JPS58149045A (ja) | 1982-02-26 | 1982-11-19 | 光学的リソグラフイ方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4414314A (US06582424-20030624-M00016.png) |
| EP (1) | EP0087582B1 (US06582424-20030624-M00016.png) |
| JP (1) | JPS58149045A (US06582424-20030624-M00016.png) |
| DE (1) | DE3375433D1 (US06582424-20030624-M00016.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02139011U (US06582424-20030624-M00016.png) * | 1989-04-27 | 1990-11-20 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0612452B2 (ja) * | 1982-09-30 | 1994-02-16 | ブリュ−ワ−・サイエンス・インコ−ポレイテッド | 集積回路素子の製造方法 |
| DE3324795A1 (de) * | 1983-07-09 | 1985-01-17 | Merck Patent Gmbh, 6100 Darmstadt | Negativ arbeitende fotoresistzusammensetzungen mit strahlungsabsorbierenden zusaetzen |
| JPS6088941A (ja) * | 1983-10-21 | 1985-05-18 | Nagase Kasei Kogyo Kk | フオトレジスト組成物 |
| US4529685A (en) * | 1984-03-02 | 1985-07-16 | Advanced Micro Devices, Inc. | Method for making integrated circuit devices using a layer of indium arsenide as an antireflective coating |
| JPS60220931A (ja) * | 1984-03-06 | 1985-11-05 | Tokyo Ohka Kogyo Co Ltd | 感光性樹脂用下地材料 |
| US4902770A (en) * | 1984-03-06 | 1990-02-20 | Tokyo Ohka Kogyo Co., Ltd. | Undercoating material for photosensitive resins |
| US4535053A (en) * | 1984-06-11 | 1985-08-13 | General Electric Company | Multilayer photoresist process utilizing cinnamic acid derivatives as absorbant dyes |
| JPS61122649A (ja) * | 1984-11-19 | 1986-06-10 | Fuji Photo Film Co Ltd | ポジ型感光性平版印刷版 |
| US4828960A (en) * | 1985-01-07 | 1989-05-09 | Honeywell Inc. | Reflection limiting photoresist composition with two azo dyes |
| US5334481A (en) * | 1985-05-02 | 1994-08-02 | Ciba-Geigy Corporation | Positive diazo quinone photoresist compositions containing antihalation compound |
| US4626492A (en) * | 1985-06-04 | 1986-12-02 | Olin Hunt Specialty Products, Inc. | Positive-working o-quinone diazide photoresist composition containing a dye and a trihydroxybenzophenone compound |
| US4650745A (en) * | 1985-06-04 | 1987-03-17 | Philip A. Hunt Chemical Corporation | Method of forming a resist pattern by radiation exposure of positive-working resist coating comprising a dye and a trihydroxybenzophenone compound and subsequent aqueous alkaline development |
| CA1321315C (en) * | 1986-04-11 | 1993-08-17 | Yoichi Mori | Printing plate |
| JPH01204045A (ja) * | 1988-02-10 | 1989-08-16 | Nec Corp | パターン形成方法 |
| JPH022568A (ja) * | 1988-06-15 | 1990-01-08 | Nec Corp | パターン形成方法 |
| EP0379924A3 (de) * | 1989-01-23 | 1990-11-07 | Siemens Aktiengesellschaft | Vefahren zur Verringerung reflektionsbedingter Srukturgrössenschwankungen in einer Deckschicht bei der in der Herstellung integrierten Schaltungen in einem Substrat verwendeten optischen Lithographie |
| JPH06255232A (ja) * | 1991-09-11 | 1994-09-13 | Cmk Corp | プリント配線板の製造方法 |
| WO2010086850A2 (en) | 2009-01-29 | 2010-08-05 | Digiflex Ltd. | Process for producing a photomask on a photopolymeric surface |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498182A (US06582424-20030624-M00016.png) * | 1972-05-10 | 1974-01-24 | ||
| JPS5158072A (ja) * | 1974-11-18 | 1976-05-21 | Matsushita Electric Ind Co Ltd | Handotaisochinoseizohoho |
| US4023185A (en) * | 1976-03-19 | 1977-05-10 | Rca Corporation | Ablative optical recording medium |
| JPS5346700A (en) * | 1976-10-12 | 1978-04-26 | Fujitsu Ltd | Exposuring method for resist |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1655127A (en) * | 1925-08-28 | 1928-01-03 | Wadsworth Watch Case Co | Photographic and etching process and product |
| DE1597597A1 (de) * | 1967-09-14 | 1970-09-24 | Wilhelm Guckert | Verfahren zur Reduzierung der Unterstrahlungseffekte bei Kopierverfahren der graphischen Technik,insbesondere im Hinblick auf lichtempfindliche Schichten,die auf metallische Oberflaechen (Offsetdruckplatten- und Folien,Metallplatten fuer die Herstellung von Hochdruckklischees,kupferkaschiertes Isolationsm |
| US3884698A (en) * | 1972-08-23 | 1975-05-20 | Hewlett Packard Co | Method for achieving uniform exposure in a photosensitive material on a semiconductor wafer |
| US4102683A (en) * | 1977-02-10 | 1978-07-25 | Rca Corp. | Nonreflecting photoresist process |
| US4328298A (en) * | 1979-06-27 | 1982-05-04 | The Perkin-Elmer Corporation | Process for manufacturing lithography masks |
| US4348471A (en) * | 1981-06-15 | 1982-09-07 | Polychrome Corporation | Positive acting composition yielding pre-development high visibility image after radiation exposure comprising acid free novolak, diazo oxide and acid sensitive dyestuff |
-
1982
- 1982-02-26 US US06/352,929 patent/US4414314A/en not_active Expired - Fee Related
- 1982-11-19 JP JP57202209A patent/JPS58149045A/ja active Granted
-
1983
- 1983-01-26 EP EP83100693A patent/EP0087582B1/en not_active Expired
- 1983-01-26 DE DE8383100693T patent/DE3375433D1/de not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498182A (US06582424-20030624-M00016.png) * | 1972-05-10 | 1974-01-24 | ||
| JPS5158072A (ja) * | 1974-11-18 | 1976-05-21 | Matsushita Electric Ind Co Ltd | Handotaisochinoseizohoho |
| US4023185A (en) * | 1976-03-19 | 1977-05-10 | Rca Corporation | Ablative optical recording medium |
| JPS5346700A (en) * | 1976-10-12 | 1978-04-26 | Fujitsu Ltd | Exposuring method for resist |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02139011U (US06582424-20030624-M00016.png) * | 1989-04-27 | 1990-11-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0087582B1 (en) | 1988-01-20 |
| US4414314A (en) | 1983-11-08 |
| JPS58149045A (ja) | 1983-09-05 |
| EP0087582A3 (en) | 1985-01-23 |
| DE3375433D1 (en) | 1988-02-25 |
| EP0087582A2 (en) | 1983-09-07 |
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