JPH0160536U - - Google Patents
Info
- Publication number
- JPH0160536U JPH0160536U JP15592787U JP15592787U JPH0160536U JP H0160536 U JPH0160536 U JP H0160536U JP 15592787 U JP15592787 U JP 15592787U JP 15592787 U JP15592787 U JP 15592787U JP H0160536 U JPH0160536 U JP H0160536U
- Authority
- JP
- Japan
- Prior art keywords
- plane
- supply nozzle
- tip
- seal
- chip seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001154 acute effect Effects 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第１図は、この考案に係るチツプシール供給ノ
ズルの一実施例を示す斜視図、第２図は、その変
形例を示す図、第３図は、チツプシール供給ノズ
ルの応用例を示す斜視図、第４図は、チツプシー
ル供給装置のノズル保持部の構造を示す断面図、
第５図は、チツプシール供給ノズルの動作を示す
工程図、第６図は、従来のチツプシール供給ノズ
ルを示す断面図である。
１…チツプシール、２…従来のチツプシール供
給ノズル、３…パツケージ、４…チツプシール供
給ノズル、５…カツタ、６…チツプ、７…コレツ
トノズル、１０…チツプシール供給装置、１１…
ロール状シール。
FIG. 1 is a perspective view showing an embodiment of the tip seal supply nozzle according to the invention, FIG. 2 is a view showing a modification thereof, and FIG. 3 is a perspective view showing an application example of the tip seal supply nozzle. Figure 4 is a sectional view showing the structure of the nozzle holding part of the tip seal supply device;
FIG. 5 is a process diagram showing the operation of the tip seal supply nozzle, and FIG. 6 is a sectional view showing the conventional tip seal supply nozzle. DESCRIPTION OF SYMBOLS 1... Chip seal, 2... Conventional chip seal supply nozzle, 3... Package, 4... Chip seal supply nozzle, 5... Cutter, 6... Chip, 7... Collet nozzle, 10... Chip seal supply device, 11...
Rolled sticker.
Claims (1)
着し、ガスを吹き出すことにより当該チツプシー
ルを所定平面上に載置させるチツプシール供給ノ
ズルにおいて、 前記外気およびガスを通過させるため前記平面
とほぼ直交する方向に形設された通過孔と、 少なくとも前記平面に対し鋭角で傾斜するテー
パ面を有し、前記チツプシールを着脱するため前
記通過孔の先端に形設された着脱部を備えて構成
されることを特徴とするチツプシール供給ノズル
。 ２ 前記着脱部が、前記平面に対し鋭角で傾斜す
るテーパ面および前記平面とほぼ平行する平面を
有して構成されることを特徴とする実用新案登録
請求の範囲第１項記載のチツプシール供給ノズル
。[Claims for Utility Model Registration] 1. A chip seal supply nozzle that adsorbs a chip seal by suctioning outside air and places the chip seal on a predetermined plane by blowing out gas, wherein the chip seal is attached to the flat surface in order to pass the outside air and gas. a passage hole formed in a direction substantially perpendicular to the plane, and a tapered surface inclined at an acute angle with respect to the plane, and an attachment/detachment part formed at the tip of the passage hole for attaching and detaching the tip seal. A tip seal supply nozzle comprising: 2. The tip seal supply nozzle according to claim 1, wherein the attachment/detachment part has a tapered surface inclined at an acute angle with respect to the plane and a plane substantially parallel to the plane. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592787U JPH0648841Y2 (en) | 1987-10-12 | 1987-10-12 | Tip seal supply nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15592787U JPH0648841Y2 (en) | 1987-10-12 | 1987-10-12 | Tip seal supply nozzle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0160536U true JPH0160536U (en) | 1989-04-17 |
| JPH0648841Y2 JPH0648841Y2 (en) | 1994-12-12 |
Family
ID=31433996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15592787U Expired - Lifetime JPH0648841Y2 (en) | 1987-10-12 | 1987-10-12 | Tip seal supply nozzle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648841Y2 (en) |
-
1987
- 1987-10-12 JP JP15592787U patent/JPH0648841Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648841Y2 (en) | 1994-12-12 |