JPH0160347B2 - - Google Patents
Info
- Publication number
- JPH0160347B2 JPH0160347B2 JP10163982A JP10163982A JPH0160347B2 JP H0160347 B2 JPH0160347 B2 JP H0160347B2 JP 10163982 A JP10163982 A JP 10163982A JP 10163982 A JP10163982 A JP 10163982A JP H0160347 B2 JPH0160347 B2 JP H0160347B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- nozzle
- brazing
- storage tank
- iron core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10163982A JPS58218369A (ja) | 1982-06-14 | 1982-06-14 | ろう付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10163982A JPS58218369A (ja) | 1982-06-14 | 1982-06-14 | ろう付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218369A JPS58218369A (ja) | 1983-12-19 |
| JPH0160347B2 true JPH0160347B2 (enExample) | 1989-12-22 |
Family
ID=14305952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10163982A Granted JPS58218369A (ja) | 1982-06-14 | 1982-06-14 | ろう付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218369A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH042445U (enExample) * | 1990-04-19 | 1992-01-10 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2611109A1 (fr) * | 1987-02-12 | 1988-08-19 | Outillages Scient Lab | Installations de soudure automatique a l'etain |
-
1982
- 1982-06-14 JP JP10163982A patent/JPS58218369A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH042445U (enExample) * | 1990-04-19 | 1992-01-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58218369A (ja) | 1983-12-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3705457A (en) | Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces | |
| EP0083680B1 (en) | Wavesoldering of chips | |
| KR100504404B1 (ko) | 납땜장치 | |
| US4568012A (en) | Soldering apparatus | |
| JPH0160347B2 (enExample) | ||
| EP0159425B1 (en) | Soldering apparatus | |
| US4437605A (en) | Methods of and apparatus for pumping solder | |
| KR100504403B1 (ko) | 납땜장치 | |
| JPS63268563A (ja) | 印刷配線回路板をはんだでマス結合する装置 | |
| US7650851B2 (en) | Nozzle for soldering apparatus | |
| CA1195880A (en) | Wave soldering apparatus and method | |
| EP0858856B1 (en) | Brazing apparatus | |
| JPH0231628B2 (enExample) | ||
| KR101140155B1 (ko) | 액체유도펌프를 이용한 땜납조 | |
| KR100504402B1 (ko) | 납땜장치 | |
| JPS595392B2 (ja) | ろう付装置のろう材送りコイル機構 | |
| JPS595391B2 (ja) | ろう付装置のろう材貯溜槽 | |
| JPS58218370A (ja) | ろう付装置 | |
| JPH0534849Y2 (enExample) | ||
| JP3771676B2 (ja) | 局所はんだ付け装置 | |
| JPH0530849Y2 (enExample) | ||
| JPS595393B2 (ja) | ろう付装置のろう材受機構 | |
| JPS61126960A (ja) | 噴流式はんだ付け装置 | |
| JP3175952B2 (ja) | 電子部品用リ−ドの半田付け装置 | |
| JP3720935B2 (ja) | 噴流式ろう付け方法およびその装置 |