JPH0158944U - - Google Patents
Info
- Publication number
- JPH0158944U JPH0158944U JP15437687U JP15437687U JPH0158944U JP H0158944 U JPH0158944 U JP H0158944U JP 15437687 U JP15437687 U JP 15437687U JP 15437687 U JP15437687 U JP 15437687U JP H0158944 U JPH0158944 U JP H0158944U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- surface roughness
- mold surface
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000003746 surface roughness Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例を示す斜視図、
第２図はモールド表面の粗さを示す図、第３図は
本考案の第２の実施例を示す斜視図、第４図は従
来例を示す斜視図である。
１……製品パツケージ、１ａ……モールド表面
、２……文字。
FIG. 1 is a perspective view showing a first embodiment of the present invention;
FIG. 2 is a diagram showing the roughness of the mold surface, FIG. 3 is a perspective view showing a second embodiment of the present invention, and FIG. 4 is a perspective view showing a conventional example. 1... Product package, 1a... Mold surface, 2... Characters.
Claims (1)
照射により生ずるモールド表面粗さより粗い表面
粗さを有することを特徴とする樹脂封止半導体装
置。 A resin-sealed semiconductor device characterized in that a mold surface of the resin-sealed semiconductor device has a surface roughness that is rougher than a mold surface roughness caused by laser irradiation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15437687U JPH0158944U (en) | 1987-10-08 | 1987-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15437687U JPH0158944U (en) | 1987-10-08 | 1987-10-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158944U true JPH0158944U (en) | 1989-04-13 |
Family
ID=31431046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15437687U Pending JPH0158944U (en) | 1987-10-08 | 1987-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158944U (en) |
-
1987
- 1987-10-08 JP JP15437687U patent/JPH0158944U/ja active Pending