JPH0157643B2 - - Google Patents
Info
- Publication number
- JPH0157643B2 JPH0157643B2 JP60153507A JP15350785A JPH0157643B2 JP H0157643 B2 JPH0157643 B2 JP H0157643B2 JP 60153507 A JP60153507 A JP 60153507A JP 15350785 A JP15350785 A JP 15350785A JP H0157643 B2 JPH0157643 B2 JP H0157643B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- resin
- substrate
- mold
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011889 copper foil Substances 0.000 claims description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 41
- 238000000465 moulding Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 31
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 26
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 26
- 239000004760 aramid Substances 0.000 claims description 18
- 229920003235 aromatic polyamide Polymers 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 16
- 239000012298 atmosphere Substances 0.000 claims description 13
- -1 polytetrafluoroethylene Polymers 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000009719 polyimide resin Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 229920013716 polyethylene resin Polymers 0.000 claims 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 16
- 230000002093 peripheral effect Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920003230 addition polyimide Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010382 chemical cross-linking Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60153507A JPS6213336A (ja) | 1985-07-12 | 1985-07-12 | 耐熱性プリント基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60153507A JPS6213336A (ja) | 1985-07-12 | 1985-07-12 | 耐熱性プリント基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6213336A JPS6213336A (ja) | 1987-01-22 |
| JPH0157643B2 true JPH0157643B2 (ko) | 1989-12-06 |
Family
ID=15564056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60153507A Granted JPS6213336A (ja) | 1985-07-12 | 1985-07-12 | 耐熱性プリント基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6213336A (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001032418A1 (fr) * | 1999-11-01 | 2001-05-10 | Kaneka Corporation | Procede et dispositif de fabrication de plaques laminees |
| JP4838509B2 (ja) * | 2004-11-12 | 2011-12-14 | 株式会社カネカ | フレキシブル金属張積層板の製造方法 |
| CN111295412B (zh) * | 2017-10-31 | 2023-02-10 | Ａｇｃ株式会社 | 成形体、金属镀层层叠体、印刷配线板及其制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5163883A (ja) * | 1974-11-30 | 1976-06-02 | Matsushita Electric Works Ltd | Ryomenshorikinzokuhakubarisekisoban |
-
1985
- 1985-07-12 JP JP60153507A patent/JPS6213336A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5163883A (ja) * | 1974-11-30 | 1976-06-02 | Matsushita Electric Works Ltd | Ryomenshorikinzokuhakubarisekisoban |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6213336A (ja) | 1987-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0157643B2 (ko) | ||
| EP0253892B1 (en) | Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof | |
| JPH08195560A (ja) | プリント回路基板の製造方法 | |
| JPS60121791A (ja) | 印刷配線板の製造方法 | |
| JPS6145511B2 (ko) | ||
| JPH06287326A (ja) | ポリアミック酸フィルムおよびそれを用いたフレキシブルプリント回路基板の製造方法 | |
| JPH11307904A (ja) | 成形回路部品およびその製造方法 | |
| JP2862101B2 (ja) | ２層ｔａｂテープの製造方法 | |
| JPH05218619A (ja) | 回路基板の製造方法 | |
| JPH0492377A (ja) | 電線の接続部 | |
| JPS61102243A (ja) | 誘電体基板 | |
| JPS62280018A (ja) | 印刷配線板用転写材と該転写材を用いた印刷配線板およびその製造法 | |
| JPH11150366A (ja) | 逐次多層配線板の製造方法 | |
| JP2633999B2 (ja) | ２層ｔａｂテープの製造方法 | |
| JPS62237793A (ja) | 印刷配線板の製造法 | |
| JPH05154975A (ja) | ポリイミド積層板の製造方法 | |
| JPH01253296A (ja) | プリント回路板の製造方法 | |
| JPH05156047A (ja) | ポリアミック酸プリプレグの製造方法 | |
| JPS63299303A (ja) | 回路素子の製造方法 | |
| JPH01130585A (ja) | 補強板一体型フレキシブル配線板の製造方法 | |
| JPS62125697A (ja) | 電気回路形成用基盤の製造方法 | |
| JPH06169148A (ja) | 金属ベース回路基板及びその製法 | |
| JPS5915369B2 (ja) | 自己支持型コイルの製造方法 | |
| JPH05212808A (ja) | 多孔質焼結シートの製造方法 | |
| JPS62158394A (ja) | 印刷配線板用転写材と該転写材を用いた印刷配線板およびその製造法 |