JPH0157643B2 - - Google Patents
Info
- Publication number
- JPH0157643B2 JPH0157643B2 JP60153507A JP15350785A JPH0157643B2 JP H0157643 B2 JPH0157643 B2 JP H0157643B2 JP 60153507 A JP60153507 A JP 60153507A JP 15350785 A JP15350785 A JP 15350785A JP H0157643 B2 JPH0157643 B2 JP H0157643B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- resin
- substrate
- mold
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011889 copper foil Substances 0.000 claims description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 41
- 229920005989 resin Polymers 0.000 claims description 41
- 238000000465 moulding Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 31
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 26
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 26
- 239000004760 aramid Substances 0.000 claims description 18
- 229920003235 aromatic polyamide Polymers 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 16
- 239000012298 atmosphere Substances 0.000 claims description 13
- -1 polytetrafluoroethylene Polymers 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000009719 polyimide resin Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 229920013716 polyethylene resin Polymers 0.000 claims 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 description 16
- 230000002093 peripheral effect Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920003230 addition polyimide Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010382 chemical cross-linking Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60153507A JPS6213336A (ja) | 1985-07-12 | 1985-07-12 | 耐熱性プリント基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60153507A JPS6213336A (ja) | 1985-07-12 | 1985-07-12 | 耐熱性プリント基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6213336A JPS6213336A (ja) | 1987-01-22 |
| JPH0157643B2 true JPH0157643B2 (fr) | 1989-12-06 |
Family
ID=15564056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60153507A Granted JPS6213336A (ja) | 1985-07-12 | 1985-07-12 | 耐熱性プリント基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6213336A (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7101455B1 (en) | 1999-11-01 | 2006-09-05 | Kaneka Corporation | Method and device for manufacturing laminated plate |
| JP4838509B2 (ja) * | 2004-11-12 | 2011-12-14 | 株式会社カネカ | フレキシブル金属張積層板の製造方法 |
| CN111295412B (zh) * | 2017-10-31 | 2023-02-10 | Ａｇｃ株式会社 | 成形体、金属镀层层叠体、印刷配线板及其制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5163883A (ja) * | 1974-11-30 | 1976-06-02 | Matsushita Electric Works Ltd | Ryomenshorikinzokuhakubarisekisoban |
-
1985
- 1985-07-12 JP JP60153507A patent/JPS6213336A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5163883A (ja) * | 1974-11-30 | 1976-06-02 | Matsushita Electric Works Ltd | Ryomenshorikinzokuhakubarisekisoban |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6213336A (ja) | 1987-01-22 |
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