JPH0153518B2 - - Google Patents
Info
- Publication number
- JPH0153518B2 JPH0153518B2 JP58081953A JP8195383A JPH0153518B2 JP H0153518 B2 JPH0153518 B2 JP H0153518B2 JP 58081953 A JP58081953 A JP 58081953A JP 8195383 A JP8195383 A JP 8195383A JP H0153518 B2 JPH0153518 B2 JP H0153518B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- insulating cover
- printed circuit
- circuit board
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 17
- 239000013039 cover film Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 238000005476 soldering Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
本発明は実装基板に関し、更に詳細には片面に
のみ回路パターンを形成したプリント基板を利用
してなる実装基板に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mounting board, and more particularly to a mounting board using a printed circuit board with a circuit pattern formed only on one side.
従来、この種の実装基板は、第１図に示される
ようにベースフイルム１の両面に銅箔パターン２
ａ，２ｂを形成したプリント基板３から構成され
ていた。このプリント基板３はその一表面の銅箔
パターン２ａの所定位置にベースフイルム１を貫
通するスルーホール４を有し、このスルーホール
４の内壁に施されたメツキ部５により一表面の銅
箔パターン２ａと他表面の銅箔パターン２ｂと導
通させていた。 Conventionally, this type of mounting board has copper foil patterns 2 on both sides of a base film 1, as shown in FIG.
It consisted of a printed circuit board 3 on which parts a and 2b were formed. This printed circuit board 3 has a through hole 4 penetrating the base film 1 at a predetermined position of the copper foil pattern 2a on one surface thereof, and the copper foil pattern on one surface is 2a and the copper foil pattern 2b on the other surface were electrically connected.
そして、従来の実装基板は、このようなプリン
ト基板３の一表面上に実装電気部品６を載置しそ
の端子を銅箔パターン２ａの所定個所に半田付け
をし、プリント基板３の両面側に絶縁性のカバー
フイルム７ａ，７ｂを密着配置して構成されてい
た。なお、実装電気部品６の載置側プリント基板
表面に配置される絶縁性カバーフイルム７ａに
は、該実装電気部品６をよけて基板表面に当該フ
イルムが密着するよう該当個所に開口部８が形成
されている。 In the conventional mounting board, the electrical component 6 is mounted on one surface of the printed circuit board 3, its terminals are soldered to predetermined locations on the copper foil pattern 2a, and the electrical components 6 are mounted on both sides of the printed circuit board 3. It was constructed by disposing insulating cover films 7a and 7b in close contact with each other. The insulating cover film 7a placed on the surface of the printed circuit board on which the mounted electrical component 6 is placed has an opening 8 at the corresponding location so that the film is in close contact with the surface of the board, avoiding the mounted electrical component 6. It is formed.
しかしながら、従来のこのような実装基板で
は、プリント基板を形成する際、ベースフイルム
１の両面に配置された銅箔をそれぞれエツチング
などによる処理によつて回路パターンに形成しな
ければならないこと、両面の銅箔パターンを所定
個所で導通させるためスルーホールを形成した後
メツキ処理を施すことを必要とすることから、そ
の製造コストが著しく高く且つ製造工程も複雑で
時間のかかるものであつた。勿論、両面回路が非
常に複雑であつたり、実装電気部品配置密度が非
常に高い場合にはこのようなプリント基板が必要
となるが、前記回路が比較的に単純で且つ実装電
気部品の配置密度が比較的に低い場合にはこのよ
うな高価なプリント基板を使用するのは不適当で
ある。 However, with such conventional mounting boards, when forming a printed circuit board, the copper foils placed on both sides of the base film 1 must be formed into a circuit pattern by etching or the like, and it is necessary to form circuit patterns on both sides. In order to make the copper foil pattern conductive at predetermined locations, it is necessary to perform a plating process after forming through-holes, so the manufacturing cost is extremely high and the manufacturing process is complicated and time-consuming. Of course, such a printed circuit board is required if the double-sided circuit is very complex or the density of electrical components mounted is very high, but if the circuit is relatively simple and the density of electrical components mounted is very high, then such a printed circuit board is required. It is inappropriate to use such an expensive printed circuit board when the
従つて、本発明の目的は、従来の実装基板の欠
点に鑑み、安価で且つ製造容易な実装基板を提供
することにある。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a mounting board that is inexpensive and easy to manufacture in view of the drawbacks of conventional mounting boards.
以下、本発明の実装基板を添付図面に示された
好適な実施例を参照して更に詳細に説明する。 Hereinafter, the mounting board of the present invention will be described in more detail with reference to preferred embodiments shown in the accompanying drawings.
第２図ないし第４図には、本発明の一実施例に
係る実装基板が符号１０で示されている。 In FIGS. 2 to 4, a mounting board according to an embodiment of the present invention is indicated by the reference numeral 10.
該実装基板１０は、第３図および第４図から明
らかなように、片面にのみ銅箔パターン１１を形
成したフレキシブルなベースフイルム１２からな
るフレキシブルプリント基板１３と、該フレキシ
ブルプリント基板１３の銅箔パターン形成表面上
に配置されたフレキシブルな絶縁性カバーフイル
ム１４とを含む。このカバーフイルム１４にはそ
の適所に所定数の開口部１５が形成されている。
この開口部１５は、その後載置される実装電気部
品の一端子が接続されるべき前記銅箔パターン１
１の所定部分１６を露出させるべく当該所定部分
１６に整合するよう予め設計された位置に形成さ
れる。更に、この絶縁性カバーフイルム１４上
に、例えばコンデンサなどの実装電気部品１７が
その一端子を前記開口部１５の領域内に位置させ
て載置され、当該端子は開口部１５において露出
した銅箔パターン１１の所定部分１６と半田付け
によつて接続される。この接続部即ち半田付け部
を符号１８ａで示す。 As is clear from FIGS. 3 and 4, the mounting board 10 includes a flexible printed circuit board 13 made of a flexible base film 12 on which a copper foil pattern 11 is formed only on one side, and a copper foil of the flexible printed circuit board 13. a flexible insulating cover film 14 disposed over the patterned surface. A predetermined number of openings 15 are formed in the cover film 14 at appropriate locations.
This opening 15 is connected to the copper foil pattern 1 to which one terminal of the mounted electric component to be mounted afterwards is connected.
It is formed at a pre-designed position to align with the predetermined portion 16 of the 1 to expose the predetermined portion 16 . Further, a mounted electrical component 17 such as a capacitor, for example, is placed on the insulating cover film 14 with one terminal thereof located within the area of the opening 15, and the terminal is connected to the copper foil exposed in the opening 15. It is connected to a predetermined portion 16 of the pattern 11 by soldering. This connection or soldering portion is designated by the reference numeral 18a.
そして、第２図に示されるようなバスプレート
１９が絶縁性カバーフイルム１４に配置される。
このバスプレート１９は薄い可撓性の金属板をプ
レスなどによつて打抜いて形成することができ、
その配線パターンとなる導体部分２０は実装電気
部品１７の他方の端子近傍を通るように実装電気
部品１７の配置状態やフレキシブルプリント基板
１３の銅箔パターン１１などの形状に応じた形に
形成される。 Then, a bus plate 19 as shown in FIG. 2 is placed on the insulating cover film 14.
This bus plate 19 can be formed by punching out a thin flexible metal plate using a press or the like.
The conductor portion 20 serving as the wiring pattern is formed in a shape corresponding to the arrangement of the mounted electrical component 17 and the shape of the copper foil pattern 11 of the flexible printed circuit board 13 so as to pass near the other terminal of the mounted electrical component 17. .
また、このバスプレート１９の導体部分２０に
おける実装電気部品１７端子接続該当部には、そ
の半田付けを容易にするため多少幅拡に形成され
た接続端２１が形成され、該接続端２１と実装電
気部品１７の他方の端子とが半田付けにより接続
される。この半田付け部を符号１８ｂで示す。 Further, in the conductor portion 20 of the bus plate 19, a connection end 21 is formed with a slightly wider width in order to facilitate soldering, and the connection end 21 is formed at a portion corresponding to the terminal connection of the mounted electrical component 17. The other terminal of the electric component 17 is connected by soldering. This soldered portion is designated by the reference numeral 18b.
この実施例においては、実装基板がフレキシブ
ルのものとすべく各構成部分即ちベースプレー
ト、カバーフイルムおよびバスプレートをフレキ
シブルのものとしたが、勿論ハードのものであつ
てもよい。また、バスプレート１９は各実装電気
部品１７全てに共通な回路をパターンとして一つ
の一体な金属配線板としたが、必要に応じてこの
バスプレートを複数にして回路構成することもで
きる。 In this embodiment, each component, ie, the base plate, cover film, and bus plate, is made flexible in order to make the mounting board flexible, but of course they may be made of hard materials. Furthermore, although the bus plate 19 is formed into one integral metal wiring board with a pattern common to all of the mounted electrical components 17, a plurality of bus plates may be used to form a circuit if necessary.
このような本発明の実装基板によれば、従来の
ような両面に銅箔パターンを形成したプリント基
板を用いず片面にのみ銅箔パターンを形成したも
のでよいからその裏面の銅箔配置およびエツチン
グなどによるそのパターン形成が不要となり、ま
た両面のパターンを接続するためのスルーホール
の形成およびその内壁へのメツキ処理も不要とな
り、しかも前記裏面の銅箔パターンに代えるバス
プレートはプレスなどにより別体に極めて容易に
形成できるため、実装基板全体のコストを非常に
低下させることができ、またその製造も非常に容
易にできる。 According to the mounting board of the present invention, it is sufficient to form a copper foil pattern on only one side, instead of using a conventional printed circuit board with copper foil patterns formed on both sides. It is no longer necessary to form a pattern using a method such as a copper foil pattern, etc., and it is also no longer necessary to form through holes to connect the patterns on both sides and to plate the inner walls of the through holes.Moreover, the bus plate, which replaces the copper foil pattern on the back side, is made separately by pressing or the like. Since it can be formed extremely easily, the cost of the entire mounting board can be greatly reduced, and its manufacture can also be made very easily.
第１図は従来の実装基板を概略的に示す断面
図、第２図は本発明の一実施例に係る実装基板を
概略的に示す組立状態の斜視図、第３図は第２図
に示された実装基板の一部を破断し拡大して示す
断片的な斜視図、第４図は第２図に示された実装
基板を部分的に切断して示す断面図である。
１０……実装基板、１１……銅箔パターン、１
２……フレキシブルベースフイルム、１３……プ
リント基板、１４……絶縁性カバーフイルム、１
５……開口部、１７……実装電気部品、１８ａ，
１８ｂ……半田付け部、１９……バスプレート、
２０……導体部分。なお、図中同一符号は同一部
分又は相当部分を示す。
FIG. 1 is a cross-sectional view schematically showing a conventional mounting board, FIG. 2 is a perspective view schematically showing a mounting board according to an embodiment of the present invention in an assembled state, and FIG. 3 is the same as shown in FIG. FIG. 4 is a fragmentary perspective view showing a part of the mounting board shown in FIG. 2, partially cut away and shown in an enlarged manner. 10... Mounting board, 11... Copper foil pattern, 1
2... Flexible base film, 13... Printed circuit board, 14... Insulating cover film, 1
5... Opening, 17... Mounted electrical component, 18a,
18b...soldering part, 19...bus plate,
20...Conductor part. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
基板と、所定位置に開口部を有し前記プリント基
板の前記回路パターン形成表面上に配置された絶
縁性カバーと、該絶縁性カバー上に配置され平面
的にみて配線パターン形状に形成された金属板状
のバスプレートと、前記絶縁カバー上に載置され
前記絶縁性カバーの前記開口部を介して前記プリ
ント基板のパターン回路に且つ前記バスプレート
にそれぞれ各端子を接続した実装電気部品とを含
んでなる実装基板。 ２ 特許請求の範囲第１項に記載の実装基板にお
いて、前記プリント基板がベースフイルム一表面
に金属箔からなる回路パターンを形成してなるフ
レキシブルプリント基板であり、前記絶縁性カバ
ーが透明なフイルムから形成され、且つ前記バス
プレートが可撓性を有する薄い金属板から形成さ
れていることを特徴とする実装基板。[Scope of Claims] 1. A printed circuit board with a circuit pattern formed only on one side, an insulating cover having an opening at a predetermined position and disposed on the circuit pattern forming surface of the printed circuit board, and the insulating cover. a metal plate-shaped bus plate disposed on top and formed into a wiring pattern shape when viewed from above; and a bus plate placed on the insulating cover and connected to the pattern circuit of the printed circuit board through the opening of the insulating cover; A mounted board comprising mounted electrical components having respective terminals connected to the bus plate. 2. In the mounting board according to claim 1, the printed board is a flexible printed board in which a circuit pattern made of metal foil is formed on one surface of a base film, and the insulating cover is made of a transparent film. 1. A mounting board characterized in that the bus plate is formed from a flexible thin metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8195383A JPS59207684A (en) | 1983-05-11 | 1983-05-11 | Mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8195383A JPS59207684A (en) | 1983-05-11 | 1983-05-11 | Mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59207684A JPS59207684A (en) | 1984-11-24 |
| JPH0153518B2 true JPH0153518B2 (en) | 1989-11-14 |
Family
ID=13760861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8195383A Granted JPS59207684A (en) | 1983-05-11 | 1983-05-11 | Mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59207684A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5257262U (en) * | 1975-10-22 | 1977-04-25 |
-
1983
- 1983-05-11 JP JP8195383A patent/JPS59207684A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59207684A (en) | 1984-11-24 |
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