JPH0152905B2 - - Google Patents

Info

Publication number
JPH0152905B2
JPH0152905B2 JP62063928A JP6392887A JPH0152905B2 JP H0152905 B2 JPH0152905 B2 JP H0152905B2 JP 62063928 A JP62063928 A JP 62063928A JP 6392887 A JP6392887 A JP 6392887A JP H0152905 B2 JPH0152905 B2 JP H0152905B2
Authority
JP
Japan
Prior art keywords
frame
outer frame
lead
portions
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP62063928A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62252959A (ja
Inventor
Kazuo Shimizu
Kazuo Hoya
Fumihito Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62063928A priority Critical patent/JPS62252959A/ja
Publication of JPS62252959A publication Critical patent/JPS62252959A/ja
Publication of JPH0152905B2 publication Critical patent/JPH0152905B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP62063928A 1987-03-20 1987-03-20 リ−ドフレ−ム Granted JPS62252959A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62063928A JPS62252959A (ja) 1987-03-20 1987-03-20 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62063928A JPS62252959A (ja) 1987-03-20 1987-03-20 リ−ドフレ−ム

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP13163978A Division JPS5559749A (en) 1978-10-27 1978-10-27 Lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1614089A Division JPH01230263A (ja) 1989-01-27 1989-01-27 電子装置の組立方法

Publications (2)

Publication Number Publication Date
JPS62252959A JPS62252959A (ja) 1987-11-04
JPH0152905B2 true JPH0152905B2 (cg-RX-API-DMAC7.html) 1989-11-10

Family

ID=13243498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62063928A Granted JPS62252959A (ja) 1987-03-20 1987-03-20 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS62252959A (cg-RX-API-DMAC7.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265670A (en) * 1975-11-27 1977-05-31 Mitsubishi Electric Corp Production of semiconductor device
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same
JPS5559749A (en) * 1978-10-27 1980-05-06 Hitachi Ltd Lead frame

Also Published As

Publication number Publication date
JPS62252959A (ja) 1987-11-04

Similar Documents

Publication Publication Date Title
JP2565091B2 (ja) 半導体装置およびその製造方法
JPH0817954A (ja) 電気部品用パッケージおよびその製造方法
US7713783B2 (en) Electronic component package, electronic component using the package, and method for manufacturing electronic component package
JPS6238863B2 (cg-RX-API-DMAC7.html)
JPH0614528B2 (ja) 単一インライン型集積電子部品及びその製造方法
JPH08139257A (ja) 面実装型半導体装置
JPS63258050A (ja) 半導体装置
US6541856B2 (en) Thermally enhanced high density semiconductor package
JPH038113B2 (cg-RX-API-DMAC7.html)
JPH0152905B2 (cg-RX-API-DMAC7.html)
CN112447651A (zh) 具有三维导热焊盘的电子设备
JPS63296252A (ja) 樹脂封止型半導体装置
JPH0357624B2 (cg-RX-API-DMAC7.html)
KR950003337B1 (ko) 내연기관용 점화장치의 제조방법
JP3840708B2 (ja) サーミスタセンサ
JPH0950830A (ja) ターミナルとリード線の接合部構造及びターミナルとリード線の接合方法
JPS63187657A (ja) 半導体装置の製造方法
CN110249485A (zh) 连接器及具备该连接器的电连接组件的制造方法
JPS6234154B2 (cg-RX-API-DMAC7.html)
JPH01276655A (ja) トランスファーモールド型集積回路
JPS63160262A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPS6248375B2 (cg-RX-API-DMAC7.html)
JPS6244815B2 (cg-RX-API-DMAC7.html)
JPH046859A (ja) 樹脂封止型半導体装置
JPH1092998A (ja) 電子デバイス製造用リードフレーム