JPH01501242A - 高速安全弁の制御方法及び装置 - Google Patents

高速安全弁の制御方法及び装置

Info

Publication number
JPH01501242A
JPH01501242A JP62505729A JP50572987A JPH01501242A JP H01501242 A JPH01501242 A JP H01501242A JP 62505729 A JP62505729 A JP 62505729A JP 50572987 A JP50572987 A JP 50572987A JP H01501242 A JPH01501242 A JP H01501242A
Authority
JP
Japan
Prior art keywords
valve
pressure
solenoid valve
response
hydraulic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62505729A
Other languages
English (en)
Japanese (ja)
Inventor
ハルトフイール，ヨハネス
シユミツト，マンフレート
Original Assignee
ボツプ　ウント　ロイテル　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ボツプ　ウント　ロイテル　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング filed Critical ボツプ　ウント　ロイテル　ゲゼルシヤフト　ミツト　ベシユレンクテル　ハフツング
Publication of JPH01501242A publication Critical patent/JPH01501242A/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/124—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston servo actuated
    • F16K31/1245—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston servo actuated with more than one valve
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B19/00—Testing; Calibrating; Fault detection or monitoring; Simulation or modelling of fluid-pressure systems or apparatus not otherwise provided for
    • F15B19/002—Calibrating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
    • F16K17/02—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/024—Controlling the inlet pressure, e.g. back-pressure regulator
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2093—Control of fluid pressure characterised by the use of electric means with combination of electric and non-electric auxiliary power
    • G05D16/2097—Control of fluid pressure characterised by the use of electric means with combination of electric and non-electric auxiliary power using pistons within the main valve
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/537—Multiple bond wires having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B2211/00—Circuits for servomotor systems
    • F15B2211/50—Pressure control
    • F15B2211/505—Pressure control characterised by the type of pressure control means
    • F15B2211/50509—Pressure control characterised by the type of pressure control means the pressure control means controlling a pressure upstream of the pressure control means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B2211/00—Circuits for servomotor systems
    • F15B2211/50—Pressure control
    • F15B2211/505—Pressure control characterised by the type of pressure control means
    • F15B2211/50554—Pressure control characterised by the type of pressure control means the pressure control means controlling a pressure downstream of the pressure control means, e.g. pressure reducing valve
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B2211/00—Circuits for servomotor systems
    • F15B2211/50—Pressure control
    • F15B2211/515—Pressure control characterised by the connections of the pressure control means in the circuit
    • F15B2211/5158—Pressure control characterised by the connections of the pressure control means in the circuit being connected to a pressure source and an output member
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B2211/00—Circuits for servomotor systems
    • F15B2211/50—Pressure control
    • F15B2211/515—Pressure control characterised by the connections of the pressure control means in the circuit
    • F15B2211/5159—Pressure control characterised by the connections of the pressure control means in the circuit being connected to an output member and a return line
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15B—SYSTEMS ACTING BY MEANS OF FLUIDS IN GENERAL; FLUID-PRESSURE ACTUATORS, e.g. SERVOMOTORS; DETAILS OF FLUID-PRESSURE SYSTEMS, NOT OTHERWISE PROVIDED FOR
    • F15B2211/00—Circuits for servomotor systems
    • F15B2211/50—Pressure control
    • F15B2211/52—Pressure control characterised by the type of actuation
    • F15B2211/526—Pressure control characterised by the type of actuation electrically or electronically
    • F15B2211/527—Pressure control characterised by the type of actuation electrically or electronically with signal modulation, e.g. pulse width modulation [PWM]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0396—Involving pressure control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/86389—Programmer or timer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Fluid-Driven Valves (AREA)
  • Safety Valves (AREA)
  • Magnetically Actuated Valves (AREA)
  • Control Of Fluid Pressure (AREA)
JP62505729A 1986-10-04 1987-10-01 高速安全弁の制御方法及び装置 Pending JPH01501242A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863633851 DE3633851A1 (de) 1986-10-04 1986-10-04 Verfahren und einrichtung zum steuern von sicherheitsventilen
DE3633851.6 1986-10-04

Publications (1)

Publication Number Publication Date
JPH01501242A true JPH01501242A (ja) 1989-04-27

Family

ID=6311060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62505729A Pending JPH01501242A (ja) 1986-10-04 1987-10-01 高速安全弁の制御方法及び装置

Country Status (7)

Country Link
US (1) US4911192A (https=)
EP (1) EP0293398B1 (https=)
JP (1) JPH01501242A (https=)
KR (1) KR880701907A (https=)
DE (1) DE3633851A1 (https=)
FI (1) FI882560A7 (https=)
WO (1) WO1988002510A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3927110A1 (de) * 1989-08-17 1991-02-21 Bosch Gmbh Robert Magnetventil mit erregerstrom-steuervorrichtung
DE4008749C2 (de) * 1990-03-19 1999-02-18 Mannesmann Vdo Ag Drucksteueranordnung
US5198241A (en) * 1991-01-29 1993-03-30 Spex Industries, Inc. Apparatus for preparation of samples for spectrographic analysis
DE4404224A1 (de) * 1994-02-10 1995-08-17 Danfoss As Hydraulische Funktionseinheit
US5522428A (en) * 1994-08-29 1996-06-04 Duvall; Paul F. Natural gas vehicle tank life sensor and control
US6044857A (en) * 1997-02-13 2000-04-04 Erie Manufacturing Company Electronic controller for a modulating valve
US6186167B1 (en) 1999-03-04 2001-02-13 Fisher Controls International Inc. Emergency shutdown test system
US6968851B2 (en) * 2001-04-11 2005-11-29 Asco Controls, L.P. Double block valve with proving system
DE10225171B3 (de) 2002-06-06 2004-02-26 Mimidos-Verfahrenstechnik Gmbh Verfahren und Vorrichtung zur Dosierung von Fluiden
CA2393522C (en) * 2002-07-15 2005-05-17 Saskatchewan Research Council Method for determining if deterioration in structural integrity of a pressure vessel, a pressure vessel, and a structural integrity testing apparatus therefor
US7556238B2 (en) * 2005-07-20 2009-07-07 Fisher Controls International Llc Emergency shutdown system
JP4596426B2 (ja) * 2005-09-21 2010-12-08 日立アプライアンス株式会社 熱源装置
DE102006040476A1 (de) 2006-08-29 2008-03-06 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Hydraulische oder pneumatische Steuerungseinrichtung eines automatisierten Schaltgetriebes
US8237389B2 (en) * 2008-11-12 2012-08-07 Irobot Corporation Multi mode safety control module
JP5438745B2 (ja) * 2011-11-28 2014-03-12 本田技研工業株式会社 流体供給システム
US9394928B2 (en) * 2012-07-31 2016-07-19 Caterpillar Inc. Dynamic seal wear mitigation system
US9651067B2 (en) * 2012-07-31 2017-05-16 Caterpillar Inc. Hydraulic system with a dynamic seal
KR101503376B1 (ko) * 2014-02-25 2015-03-18 주식회사 어텍 유압 실린더용 밸브의 제어 시스템
JP6745812B2 (ja) 2015-03-18 2020-08-26 オートマティック スイッチ カンパニー ピークホールドドライバによって制御されるソレノイドバルブのドロップアウトの確保
DE102016102387A1 (de) * 2015-07-31 2017-02-02 Voith Patent Gmbh Hydraulischer Antrieb zum Ausführen einer linearen Bewegung
DE102015119108A1 (de) * 2015-11-06 2017-05-11 Pleiger Maschinenbau Gmbh & Co. Kg Verfahren und Vorrichtung zum Ansteuern einer hydraulisch betätigten Antriebseinheit einer Armatur
JP6582347B2 (ja) * 2015-12-10 2019-10-02 三菱造船株式会社 安全弁システム、タンク、船舶、船舶における安全弁システムの運用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3665945A (en) * 1971-02-03 1972-05-30 M & J Valve Co Valve control system and method
DE3124904A1 (de) * 1980-07-04 1982-05-06 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid "stromventil mit einem hydraulisch verstellbaren drosselventil"
DE3042951C2 (de) * 1980-11-14 1986-04-10 Brown Boveri Reaktor GmbH, 6800 Mannheim Verfahren zum Ansteuern eines Ventils an druckbelasteten Anlagen
JPS5943280A (ja) * 1982-09-06 1984-03-10 Kobe Steel Ltd バルブ用アクチユエ−タ
US4550747A (en) * 1983-10-05 1985-11-05 Digital Hydraulics, Inc. Digital fluid pressure flow rate and position control system
US4720807A (en) * 1985-05-20 1988-01-19 Vacuum General, Inc. Adaptive pressure control system
US4694390A (en) * 1985-06-28 1987-09-15 Electric Power Research Institute, Inc. Microprocessor-based control and diagnostic system for motor operated valves

Also Published As

Publication number Publication date
DE3633851A1 (de) 1988-04-28
DE3633851C2 (https=) 1989-08-10
US4911192A (en) 1990-03-27
KR880701907A (ko) 1988-11-07
FI882560A0 (fi) 1988-05-31
WO1988002510A1 (fr) 1988-04-07
EP0293398A1 (de) 1988-12-07
EP0293398B1 (de) 1993-07-28
FI882560A7 (fi) 1988-05-31

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