JPH0145735B2 - - Google Patents
Info
- Publication number
- JPH0145735B2 JPH0145735B2 JP2906182A JP2906182A JPH0145735B2 JP H0145735 B2 JPH0145735 B2 JP H0145735B2 JP 2906182 A JP2906182 A JP 2906182A JP 2906182 A JP2906182 A JP 2906182A JP H0145735 B2 JPH0145735 B2 JP H0145735B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- defects
- defect inspection
- mask
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000007547 defect Effects 0.000 claims description 46
- 238000007689 inspection Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000007781 pre-processing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000003111 delayed effect Effects 0.000 description 20
- 230000015654 memory Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 5
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57029061A JPS58147114A (ja) | 1982-02-26 | 1982-02-26 | パタ−ンの欠陥検査方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57029061A JPS58147114A (ja) | 1982-02-26 | 1982-02-26 | パタ−ンの欠陥検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58147114A JPS58147114A (ja) | 1983-09-01 |
JPH0145735B2 true JPH0145735B2 (xx) | 1989-10-04 |
Family
ID=12265846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57029061A Granted JPS58147114A (ja) | 1982-02-26 | 1982-02-26 | パタ−ンの欠陥検査方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58147114A (xx) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60143704A (ja) * | 1983-12-29 | 1985-07-30 | Nippon Jido Seigyo Kk | パタ−ンの欠陥検査方法 |
US4589141A (en) * | 1984-03-12 | 1986-05-13 | Texas Instruments Incorporated | Apparatus for automatically inspecting printed labels |
JP4644210B2 (ja) * | 2005-01-14 | 2011-03-02 | 富士通セミコンダクター株式会社 | パターン欠陥検査方法 |
-
1982
- 1982-02-26 JP JP57029061A patent/JPS58147114A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58147114A (ja) | 1983-09-01 |
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