JPH0145225B2 - - Google Patents

Info

Publication number
JPH0145225B2
JPH0145225B2 JP55073147A JP7314780A JPH0145225B2 JP H0145225 B2 JPH0145225 B2 JP H0145225B2 JP 55073147 A JP55073147 A JP 55073147A JP 7314780 A JP7314780 A JP 7314780A JP H0145225 B2 JPH0145225 B2 JP H0145225B2
Authority
JP
Japan
Prior art keywords
switch
laser
excitation
pulse
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55073147A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56169347A (en
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP7314780A priority Critical patent/JPS56169347A/ja
Publication of JPS56169347A publication Critical patent/JPS56169347A/ja
Publication of JPH0145225B2 publication Critical patent/JPH0145225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P54/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Lasers (AREA)
JP7314780A 1980-05-31 1980-05-31 Laser scribing device Granted JPS56169347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7314780A JPS56169347A (en) 1980-05-31 1980-05-31 Laser scribing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7314780A JPS56169347A (en) 1980-05-31 1980-05-31 Laser scribing device

Publications (2)

Publication Number Publication Date
JPS56169347A JPS56169347A (en) 1981-12-26
JPH0145225B2 true JPH0145225B2 (enExample) 1989-10-03

Family

ID=13509788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7314780A Granted JPS56169347A (en) 1980-05-31 1980-05-31 Laser scribing device

Country Status (1)

Country Link
JP (1) JPS56169347A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637244A (en) * 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
US10286487B2 (en) 2013-02-28 2019-05-14 Ipg Photonics Corporation Laser system and method for processing sapphire
KR102176313B1 (ko) 2013-02-28 2020-11-09 아이피지 포토닉스 코포레이션 사파이어를 처리하기 위한 레이저 시스템 및 방법
WO2016033494A1 (en) 2014-08-28 2016-03-03 Ipg Photonics Corporation System and method for laser beveling and/or polishing
EP3186030B1 (en) 2014-08-28 2023-02-22 IPG Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
KR102423775B1 (ko) * 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5418129U (enExample) * 1978-06-21 1979-02-06

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method

Also Published As

Publication number Publication date
JPS56169347A (en) 1981-12-26

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