JPH0144621B2 - - Google Patents
Info
- Publication number
- JPH0144621B2 JPH0144621B2 JP14853585A JP14853585A JPH0144621B2 JP H0144621 B2 JPH0144621 B2 JP H0144621B2 JP 14853585 A JP14853585 A JP 14853585A JP 14853585 A JP14853585 A JP 14853585A JP H0144621 B2 JPH0144621 B2 JP H0144621B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- unit
- wafer
- ring frame
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004804 winding Methods 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 9
- 238000013459 approach Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 20
- 238000007667 floating Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 5
- 230000002265 prevention Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Control Of Cutting Processes (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Adhesive Tape Dispensing Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60148535A JPS628966A (ja) | 1985-07-05 | 1985-07-05 | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60148535A JPS628966A (ja) | 1985-07-05 | 1985-07-05 | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS628966A JPS628966A (ja) | 1987-01-16 |
| JPH0144621B2 true JPH0144621B2 (enrdf_load_stackoverflow) | 1989-09-28 |
Family
ID=15454949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60148535A Granted JPS628966A (ja) | 1985-07-05 | 1985-07-05 | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS628966A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6443458A (en) * | 1987-08-11 | 1989-02-15 | Nitto Denko Corp | Stick cutter for tacky tape with respect to thin board |
| JPH05178526A (ja) * | 1991-12-26 | 1993-07-20 | Santetsuku:Kk | 接着用連続紙の自動接着方法とその装置 |
| JPH1014099A (ja) * | 1996-06-21 | 1998-01-16 | Nec Corp | 過電流検出回路 |
| JP4841262B2 (ja) * | 2006-02-13 | 2011-12-21 | 株式会社東京精密 | ウェーハ処理装置 |
| JP4693696B2 (ja) | 2006-06-05 | 2011-06-01 | 株式会社東京精密 | ワーク処理装置 |
-
1985
- 1985-07-05 JP JP60148535A patent/JPS628966A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628966A (ja) | 1987-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |