JPS628966A - ウエハとリングフレ−ムの貼り合せ方法ならびに装置 - Google Patents
ウエハとリングフレ−ムの貼り合せ方法ならびに装置Info
- Publication number
- JPS628966A JPS628966A JP60148535A JP14853585A JPS628966A JP S628966 A JPS628966 A JP S628966A JP 60148535 A JP60148535 A JP 60148535A JP 14853585 A JP14853585 A JP 14853585A JP S628966 A JPS628966 A JP S628966A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- wafer
- ring
- unit
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Control Of Cutting Processes (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Adhesive Tape Dispensing Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60148535A JPS628966A (ja) | 1985-07-05 | 1985-07-05 | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60148535A JPS628966A (ja) | 1985-07-05 | 1985-07-05 | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS628966A true JPS628966A (ja) | 1987-01-16 |
JPH0144621B2 JPH0144621B2 (enrdf_load_stackoverflow) | 1989-09-28 |
Family
ID=15454949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60148535A Granted JPS628966A (ja) | 1985-07-05 | 1985-07-05 | ウエハとリングフレ−ムの貼り合せ方法ならびに装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS628966A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307509A3 (en) * | 1987-08-11 | 1990-01-24 | Nitto Denko Corporation | Sticking and cutoff device for adhesive tape for thin articles |
JPH05178526A (ja) * | 1991-12-26 | 1993-07-20 | Santetsuku:Kk | 接着用連続紙の自動接着方法とその装置 |
US5903422A (en) * | 1996-06-21 | 1999-05-11 | Nec Corporation | Overcurrent sensing circuit for power MOS field effect transistor |
KR100864985B1 (ko) * | 2006-02-13 | 2008-10-23 | 도쿄 세이미츄 코퍼레이션 리미티드 | 웨이퍼 처리 장치 |
US7490650B2 (en) | 2006-06-05 | 2009-02-17 | Tokyo Seimitsu Co., Ltd. | Workpiece processing device |
-
1985
- 1985-07-05 JP JP60148535A patent/JPS628966A/ja active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307509A3 (en) * | 1987-08-11 | 1990-01-24 | Nitto Denko Corporation | Sticking and cutoff device for adhesive tape for thin articles |
JPH05178526A (ja) * | 1991-12-26 | 1993-07-20 | Santetsuku:Kk | 接着用連続紙の自動接着方法とその装置 |
US5903422A (en) * | 1996-06-21 | 1999-05-11 | Nec Corporation | Overcurrent sensing circuit for power MOS field effect transistor |
KR100864985B1 (ko) * | 2006-02-13 | 2008-10-23 | 도쿄 세이미츄 코퍼레이션 리미티드 | 웨이퍼 처리 장치 |
US7563643B2 (en) | 2006-02-13 | 2009-07-21 | Tokyo Seimitsu Co., Ltd. | Wafer processing apparatus |
US7490650B2 (en) | 2006-06-05 | 2009-02-17 | Tokyo Seimitsu Co., Ltd. | Workpiece processing device |
Also Published As
Publication number | Publication date |
---|---|
JPH0144621B2 (enrdf_load_stackoverflow) | 1989-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |