JPH0143035B2 - - Google Patents
Info
- Publication number
- JPH0143035B2 JPH0143035B2 JP56125783A JP12578381A JPH0143035B2 JP H0143035 B2 JPH0143035 B2 JP H0143035B2 JP 56125783 A JP56125783 A JP 56125783A JP 12578381 A JP12578381 A JP 12578381A JP H0143035 B2 JPH0143035 B2 JP H0143035B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- mask
- plating liquid
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 139
- 239000007788 liquid Substances 0.000 claims description 53
- 238000000034 method Methods 0.000 claims description 13
- 230000000873 masking effect Effects 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000005684 electric field Effects 0.000 description 5
- 239000010970 precious metal Substances 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007428 craniotomy Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/07—Current distribution within the bath
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56125783A JPS5827993A (ja) | 1981-08-10 | 1981-08-10 | 微小部分メツキ方法及びその装置 |
| US06/508,659 US4483749A (en) | 1981-08-10 | 1983-06-28 | Method and apparatus for plating minute parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56125783A JPS5827993A (ja) | 1981-08-10 | 1981-08-10 | 微小部分メツキ方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5827993A JPS5827993A (ja) | 1983-02-18 |
| JPH0143035B2 true JPH0143035B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-09-18 |
Family
ID=14918735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56125783A Granted JPS5827993A (ja) | 1981-08-10 | 1981-08-10 | 微小部分メツキ方法及びその装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4483749A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JPS5827993A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5931883A (ja) * | 1982-08-12 | 1984-02-21 | Sonitsukusu:Kk | 極微小部分メツキ処理部材 |
| JPS616817A (ja) * | 1984-06-20 | 1986-01-13 | Canon Inc | シ−トコイルの製造方法 |
| JPS61138691A (ja) * | 1984-12-10 | 1986-06-26 | ハノ−バ−・リサ−チ・コ−ポレイシヨン | 固体から軽質油を除去する為の方法及び装置 |
| LU86119A1 (fr) * | 1985-10-15 | 1987-06-02 | Centre Rech Metallurgique | Dispositif de depot electrolytique et procede pour sa mise en oeuvre |
| FR2592895B1 (fr) * | 1986-01-16 | 1990-11-16 | Selectrons France | Installation pour la realisation de traitements electrolytiques localises de surfaces. |
| GB8708945D0 (en) * | 1987-04-14 | 1987-05-20 | Atomic Energy Authority Uk | Electrolytic polishing device |
| US5389961A (en) * | 1991-11-25 | 1995-02-14 | Eastman Kodak Company | Ink jet printer with variable-force ink declogging apparatus |
| US5597412A (en) * | 1995-02-15 | 1997-01-28 | Fujitsu Limited | Apparatus for forcing plating solution into via openings |
| JP3949504B2 (ja) * | 2002-04-25 | 2007-07-25 | 英夫 吉田 | 母材表面の活性化処理方法および活性化処理装置 |
| EP1653788A1 (de) * | 2004-10-28 | 2006-05-03 | Delphi Technologies, Inc. | Schattenmaske zur erzeugung eines elektrisch leitenden bereiches auf einem dreidimensionalen schaltungsträger |
| US9583125B1 (en) * | 2009-12-16 | 2017-02-28 | Magnecomp Corporation | Low resistance interface metal for disk drive suspension component grounding |
| CN113737264B (zh) * | 2021-09-22 | 2023-05-23 | 中国计量大学 | 一种微孔前处理和电镀一体化装置及方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2987460A (en) * | 1958-10-21 | 1961-06-06 | United States Steel Corp | Holder for sheet-metal sample |
| US3536594A (en) * | 1968-07-05 | 1970-10-27 | Western Electric Co | Method and apparatus for rapid gold plating integrated circuit slices |
| JPS56102590A (en) * | 1979-08-09 | 1981-08-17 | Koichi Shimamura | Method and device for plating of microarea |
-
1981
- 1981-08-10 JP JP56125783A patent/JPS5827993A/ja active Granted
-
1983
- 1983-06-28 US US06/508,659 patent/US4483749A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US4483749A (en) | 1984-11-20 |
| JPS5827993A (ja) | 1983-02-18 |
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