JPH0142355Y2 - - Google Patents

Info

Publication number

JPH0142355Y2

JPH0142355Y2 JP19932884U JP19932884U JPH0142355Y2 JP H0142355 Y2 JPH0142355 Y2 JP H0142355Y2 JP 19932884 U JP19932884 U JP 19932884U JP 19932884 U JP19932884 U JP 19932884U JP H0142355 Y2 JPH0142355 Y2 JP H0142355Y2

Authority

JP

Japan

Prior art keywords

airtight package

cap

lead

insulating material

insertion hole

Prior art date

1984-12-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 230000037431 insertion Effects 0.000 claims description 16
• 238000003780 insertion Methods 0.000 claims description 16
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
• 239000011810 insulating material Substances 0.000 description 16
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 239000011521 glass Substances 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 230000000694 effects Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 230000000630 rising effect Effects 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1