JPH0142154B2 - - Google Patents
Info
- Publication number
- JPH0142154B2 JPH0142154B2 JP6924880A JP6924880A JPH0142154B2 JP H0142154 B2 JPH0142154 B2 JP H0142154B2 JP 6924880 A JP6924880 A JP 6924880A JP 6924880 A JP6924880 A JP 6924880A JP H0142154 B2 JPH0142154 B2 JP H0142154B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- solder
- circuit board
- conductor
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 74
- 239000004020 conductor Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 28
- 230000008018 melting Effects 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6924880A JPS56165395A (en) | 1980-05-23 | 1980-05-23 | Method of mounting part on circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6924880A JPS56165395A (en) | 1980-05-23 | 1980-05-23 | Method of mounting part on circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56165395A JPS56165395A (en) | 1981-12-18 |
| JPH0142154B2 true JPH0142154B2 (enrdf_load_stackoverflow) | 1989-09-11 |
Family
ID=13397246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6924880A Granted JPS56165395A (en) | 1980-05-23 | 1980-05-23 | Method of mounting part on circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56165395A (enrdf_load_stackoverflow) |
-
1980
- 1980-05-23 JP JP6924880A patent/JPS56165395A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56165395A (en) | 1981-12-18 |