JPH0142129B2 - - Google Patents

Info

Publication number
JPH0142129B2
JPH0142129B2 JP62088716A JP8871687A JPH0142129B2 JP H0142129 B2 JPH0142129 B2 JP H0142129B2 JP 62088716 A JP62088716 A JP 62088716A JP 8871687 A JP8871687 A JP 8871687A JP H0142129 B2 JPH0142129 B2 JP H0142129B2
Authority
JP
Japan
Prior art keywords
light shielding
light
reticle
pattern
projection exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP62088716A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6323317A (ja
Inventor
Toshio Matsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP62088716A priority Critical patent/JPS6323317A/ja
Publication of JPS6323317A publication Critical patent/JPS6323317A/ja
Publication of JPH0142129B2 publication Critical patent/JPH0142129B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70066—Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Projection-Type Copiers In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP62088716A 1987-04-13 1987-04-13 投影露光装置 Granted JPS6323317A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62088716A JPS6323317A (ja) 1987-04-13 1987-04-13 投影露光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62088716A JPS6323317A (ja) 1987-04-13 1987-04-13 投影露光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP58152474A Division JPS6045252A (ja) 1983-08-23 1983-08-23 投影露光装置の照明系

Publications (2)

Publication Number Publication Date
JPS6323317A JPS6323317A (ja) 1988-01-30
JPH0142129B2 true JPH0142129B2 (enrdf_load_stackoverflow) 1989-09-11

Family

ID=13950624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62088716A Granted JPS6323317A (ja) 1987-04-13 1987-04-13 投影露光装置

Country Status (1)

Country Link
JP (1) JPS6323317A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7378355B2 (en) 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US7404863B2 (en) 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167627A (ja) * 1997-08-12 1999-03-09 Seiko Epson Corp 露光方法
JP5272584B2 (ja) * 2008-08-29 2013-08-28 株式会社ニコン 遮光ユニット、可変スリット装置、及び露光装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704946A (en) * 1969-02-20 1972-12-05 Opt Omechanisms Inc Microcircuit art generating means
JPS5393371A (en) * 1977-01-28 1978-08-16 Hitachi Ltd Device for drawing scan pattern
JPS546866A (en) * 1977-06-20 1979-01-19 Mitsubishi Heavy Ind Ltd Treating apparatus for gas containing malodorant
JPS55129333A (en) * 1979-03-28 1980-10-07 Hitachi Ltd Scale-down projection aligner and mask used for this
JPS55132039A (en) * 1979-04-02 1980-10-14 Mitsubishi Electric Corp Forming method for repeated figure
US4422755A (en) * 1980-01-18 1983-12-27 Optimetrix Corporation Frontal illumination system for semiconductive wafers
EP0032716A3 (en) * 1980-01-18 1982-09-01 Eaton-Optimetrix Inc. Illumination system for semiconductive wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7378355B2 (en) 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US7404863B2 (en) 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone

Also Published As

Publication number Publication date
JPS6323317A (ja) 1988-01-30

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