JPH0141271B2 - - Google Patents

Info

Publication number
JPH0141271B2
JPH0141271B2 JP58171426A JP17142683A JPH0141271B2 JP H0141271 B2 JPH0141271 B2 JP H0141271B2 JP 58171426 A JP58171426 A JP 58171426A JP 17142683 A JP17142683 A JP 17142683A JP H0141271 B2 JPH0141271 B2 JP H0141271B2
Authority
JP
Japan
Prior art keywords
substrate
metal
area
metal layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58171426A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59101897A (ja
Inventor
Suridatsudo Adowarupaakaa Auinashu
Hosakea Kumaaru Ananda
Rin Waizuman Renii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS59101897A publication Critical patent/JPS59101897A/ja
Priority to US06/666,323 priority Critical patent/US4617006A/en
Priority to FR8416771A priority patent/FR2554536B1/fr
Priority to DE19843440383 priority patent/DE3440383A1/de
Publication of JPH0141271B2 publication Critical patent/JPH0141271B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49224—Contact or terminal manufacturing with coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP58171426A 1982-10-20 1983-09-19 めつきされた金属層の余分な領域を除去するための方法 Granted JPS59101897A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US06/666,323 US4617006A (en) 1983-09-19 1984-10-30 Front derailleur for a bicycle
FR8416771A FR2554536B1 (fr) 1983-09-19 1984-11-02 Derailleur avant pour bicyclette comportant un element oscillant de rattrapage de jeu du cable de commande
DE19843440383 DE3440383A1 (de) 1983-09-19 1984-11-05 Vorderer kettenumwerfer fuer ein fahrrad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US435572 1982-10-20
US06/435,572 US4504322A (en) 1982-10-20 1982-10-20 Re-work method for removing extraneous metal from cermic substrates

Publications (2)

Publication Number Publication Date
JPS59101897A JPS59101897A (ja) 1984-06-12
JPH0141271B2 true JPH0141271B2 (enExample) 1989-09-04

Family

ID=23728934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58171426A Granted JPS59101897A (ja) 1982-10-20 1983-09-19 めつきされた金属層の余分な領域を除去するための方法

Country Status (4)

Country Link
US (1) US4504322A (enExample)
EP (1) EP0108897B1 (enExample)
JP (1) JPS59101897A (enExample)
DE (1) DE3363943D1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2575942B1 (fr) * 1985-01-11 1987-05-15 Thomas Jean Procede et dispositif de nettoyage par ultrasons
US4704304A (en) * 1986-10-27 1987-11-03 International Business Machines Corporation Method for repair of opens in thin film lines on a substrate
DE3729355A1 (de) * 1987-09-02 1989-03-16 Siemens Ag Verfahren zur beseitigung von stempelaufdrucken auf keramischen teilen, insbesondere elektrischen bauteilen
JPH01146584U (enExample) * 1988-03-31 1989-10-09
US4914813A (en) * 1988-11-25 1990-04-10 Innovative Packing Technology Refurbishing of prior used laminated ceramic packages
US5204055A (en) * 1989-12-08 1993-04-20 Massachusetts Institute Of Technology Three-dimensional printing techniques
US5490882A (en) * 1992-11-30 1996-02-13 Massachusetts Institute Of Technology Process for removing loose powder particles from interior passages of a body
US5775402A (en) * 1995-10-31 1998-07-07 Massachusetts Institute Of Technology Enhancement of thermal properties of tooling made by solid free form fabrication techniques
US5814161A (en) * 1992-11-30 1998-09-29 Massachusetts Institute Of Technology Ceramic mold finishing techniques for removing powder
US5437729A (en) * 1993-04-08 1995-08-01 Martin Marietta Energy Systems, Inc. Controlled removal of ceramic surfaces with combination of ions implantation and ultrasonic energy
DE4401612A1 (de) * 1994-01-20 1995-07-27 Resma Gmbh Verfahren und Vorrichtung zur Erzeugung elektrisch leitender Bereiche auf Metallverbindungen enthaltenden isolierenden Keramikwerkstücken
US5660621A (en) * 1995-12-29 1997-08-26 Massachusetts Institute Of Technology Binder composition for use in three dimensional printing
US5787578A (en) * 1996-07-09 1998-08-04 International Business Machines Corporation Method of selectively depositing a metallic layer on a ceramic substrate
US6127268A (en) * 1997-06-11 2000-10-03 Micronas Intermetall Gmbh Process for fabricating a semiconductor device with a patterned metal layer
US6645833B2 (en) 1997-06-30 2003-11-11 Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E. V. Method for producing layered structures on a substrate, substrate and semiconductor components produced according to said method
DE19730975A1 (de) * 1997-06-30 1999-01-07 Max Planck Gesellschaft Verfahren zur Herstellung von schichtartigen Gebilden auf einem Substrat, Substrat sowie mittels des Verfahrens hergestellte Halbleiterbauelemente
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
JP7525775B2 (ja) 2020-06-05 2024-07-31 日亜化学工業株式会社 金属成膜部材の製造方法、金属成膜部材、波長変換部材、又は、発光装置
CN112317457A (zh) * 2020-09-27 2021-02-05 山东国晶新材料有限公司 一种氧化铝陶瓷制品的清洗方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB789293A (en) * 1952-11-14 1958-01-15 Sparcatron Ltd Improvements in and relating to methods and means for removal of material from solid bodies
US3420758A (en) * 1965-07-06 1969-01-07 Foote Mineral Co Method for removal of adherent surface coatings from substrates
DE1627596A1 (de) * 1967-02-24 1971-07-15 Siemens Ag Verfahren zum Verzinnen und/oder Verloeten von metallischen Stellen,insbesondere der Leiterbahnen von Schaltungsplatten der Fernmeldetechnik
NL6914593A (enExample) * 1969-09-26 1971-03-30
US3698408A (en) * 1971-06-11 1972-10-17 Branson Instr Ultrasonic processing apparatus
US3898351A (en) * 1972-05-26 1975-08-05 Ibm Substrate cleaning process
US3955270A (en) * 1973-08-31 1976-05-11 Bell Telephone Laboratories, Incorporated Methods for making semiconductor devices
US3893869A (en) * 1974-05-31 1975-07-08 Rca Corp Megasonic cleaning system
US4082908A (en) * 1976-05-05 1978-04-04 Burr-Brown Research Corporation Gold plating process and product produced thereby
US4062696A (en) * 1976-07-27 1977-12-13 Kaiser Aluminum & Chemical Corporation Purification of contaminated alumina scavengers of aluminum reduction cell effluent dry scrubber systems

Also Published As

Publication number Publication date
DE3363943D1 (en) 1986-07-10
US4504322A (en) 1985-03-12
EP0108897B1 (en) 1986-06-04
EP0108897A1 (en) 1984-05-23
JPS59101897A (ja) 1984-06-12

Similar Documents

Publication Publication Date Title
EP0089559B1 (en) Method for forming metal coatings for metallurgy patterns on dielectric substrates
EP0108897B1 (en) Method for removing extraneous metal from ceramic substrates
US4493856A (en) Selective coating of metallurgical features of a dielectric substrate with diverse metals
US4704304A (en) Method for repair of opens in thin film lines on a substrate
EP0543364B1 (en) Method for manufacturing polyimide multilayer wiring substrate
US4925723A (en) Microwave integrated circuit substrate including metal filled via holes and method of manufacture
US5787578A (en) Method of selectively depositing a metallic layer on a ceramic substrate
US4200975A (en) Additive method of forming circuit crossovers
US6524889B2 (en) Method of transcribing a wiring pattern from an original substrate to a substrate with closely matched thermal expansion coefficients between both substrates for dimensional control of the transcribed pattern
JPH0738420B2 (ja) 金属被覆方法
CN116190249A (zh) 一种陶瓷基板的表面处理方法
US4501768A (en) Thin film floating zone metal coating technique
EP0089604B1 (en) Method for selectively coating metallurgical patterns on dielectric substrates
JP2708322B2 (ja) 配線基板の接続パッドの製造方法
JP3675407B2 (ja) 電子装置
JPH05198917A (ja) セラミックス配線基板の製造方法
JPS63254753A (ja) ダイヤモンド・ヒートシンクの製造方法
CN1781348A (zh) 印刷电路板,制造方法及电路装置
JP4134552B2 (ja) 転写部材及びその製造方法及び電子部品及びパターン形成方法
JPS6182493A (ja) セラミツク配線基板の製造方法
US6500528B1 (en) Enhancements in sheet processing and lead formation
JPH04146685A (ja) 修復パッド及びその製造方法
JP2004146444A (ja) 配線基板
JPH0424992A (ja) 配線基板