JPH0141031B2 - - Google Patents

Info

Publication number
JPH0141031B2
JPH0141031B2 JP57157936A JP15793682A JPH0141031B2 JP H0141031 B2 JPH0141031 B2 JP H0141031B2 JP 57157936 A JP57157936 A JP 57157936A JP 15793682 A JP15793682 A JP 15793682A JP H0141031 B2 JPH0141031 B2 JP H0141031B2
Authority
JP
Japan
Prior art keywords
bonding
wire
force
bond
instrument
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57157936A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5859811A (ja
Inventor
Ii Saruzaa Toomasu
Esu Mashefu Maikeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of JPS5859811A publication Critical patent/JPS5859811A/ja
Publication of JPH0141031B2 publication Critical patent/JPH0141031B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H10W72/0711—
    • H10W72/07533—
    • H10W72/534—
    • H10W72/5524—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP57157936A 1981-09-10 1982-09-10 超音波ボンデイング方法及び装置 Granted JPS5859811A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/300,728 US4373653A (en) 1981-09-10 1981-09-10 Method and apparatus for ultrasonic bonding
US300728 1981-09-10

Publications (2)

Publication Number Publication Date
JPS5859811A JPS5859811A (ja) 1983-04-09
JPH0141031B2 true JPH0141031B2 (index.php) 1989-09-01

Family

ID=23160334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57157936A Granted JPS5859811A (ja) 1981-09-10 1982-09-10 超音波ボンデイング方法及び装置

Country Status (5)

Country Link
US (1) US4373653A (index.php)
JP (1) JPS5859811A (index.php)
CA (1) CA1181933A (index.php)
DE (1) DE3233629A1 (index.php)
GB (1) GB2107235B (index.php)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4606490A (en) * 1982-08-24 1986-08-19 Asm Assembly Automation Limited Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer
JPS5963737A (ja) * 1982-10-04 1984-04-11 Hitachi Ltd 布線の接続方法
US4586642A (en) * 1985-05-13 1986-05-06 Kulicke And Soffa Industries Inc. Wire bond monitoring system
US4696708A (en) * 1985-11-13 1987-09-29 Amp Incorporated Ultrasonic welding
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges
EP0279216A1 (de) * 1987-02-09 1988-08-24 Siemens Aktiengesellschaft Gerät zur Messung von Bondparametern
US4786860A (en) * 1987-04-08 1988-11-22 Hughes Aircraft Company Missing wire detector
DE4001367A1 (de) * 1990-01-18 1991-09-19 Branson Ultraschall Vorrichtung zum einstellen eines maschinenparameters beim reibungsschweissen
US5186776A (en) * 1990-05-07 1993-02-16 Foster-Miller, Inc. Composite laminate translaminar reinforcement apparatus and method
US5459672A (en) * 1990-07-30 1995-10-17 Hughes Aircraft Company Electrical interconnect integrity measuring method
JPH0547860A (ja) * 1991-08-08 1993-02-26 Shinkawa Ltd ワイヤボンデイング方法
DE4131565C2 (de) * 1991-09-18 2002-04-25 Bleich Karl Heinz Verfahren zur Optimierung des Schweißprozesses bei Bondverfahren
US5170929A (en) * 1992-05-29 1992-12-15 International Business Machines Corporation Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means
US5466506A (en) * 1992-10-27 1995-11-14 Foster-Miller, Inc. Translaminar reinforcement system for Z-direction reinforcement of a fiber matrix structure
WO1995003170A1 (en) * 1993-05-04 1995-02-02 Foster-Miller, Inc. Truss reinforced foam core sandwich structure
US5374808A (en) * 1993-06-23 1994-12-20 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method and device for determining bond separation strength using induction heating
US5772814A (en) * 1996-01-26 1998-06-30 Branson Ultrasonic Corporation Welding system and method of setting welding machine parameters
US6291049B1 (en) 1998-10-20 2001-09-18 Aztex, Inc. Sandwich structure and method of making same
KR100896828B1 (ko) * 2001-10-26 2009-05-12 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 와이어 본더를 보정하는 방법
ATE338603T1 (de) * 2001-11-07 2006-09-15 F & K Delvotec Bondtech Gmbh Prüfverfahren für bondverbindungen und drahtbonder
US20050029328A1 (en) * 2003-06-18 2005-02-10 Esec Trading Sa Method for checking the quality of a wedge bond
DE102005059004A1 (de) * 2005-12-08 2007-06-14 Haver & Boecker Ohg Verfahren und Vorrichtung zum Füllen von Säcken
DE602006015192D1 (de) 2006-09-05 2010-08-12 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Regelung der Herstellung von Drahtbondverbindungen
DE102016102164A1 (de) 2016-02-08 2017-08-10 Ms Ultraschall Technologie Gmbh Ultraschall-Bearbeitungsmaschine
JP6680239B2 (ja) * 2017-02-20 2020-04-15 日亜化学工業株式会社 発光装置の製造方法
JP7794821B2 (ja) * 2020-11-05 2026-01-06 クリック アンド ソッファ インダストリーズ、インク． ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法
US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3302277A (en) * 1964-03-20 1967-02-07 Western Electric Co Methods of bonding electrical conductors to electrical components
US3458921A (en) * 1965-07-19 1969-08-05 Western Electric Co Short pulse vibratory bonding
US3763545A (en) * 1972-04-03 1973-10-09 Motorola Inc Method for control of welding apparatus
US3827619A (en) * 1973-01-19 1974-08-06 Us Navy Ultrasonic bond monitor
US3794236A (en) * 1973-05-07 1974-02-26 Raytheon Co Monitoring and control means for evaluating the performance of vibratory-type devices
GB1506164A (en) * 1974-07-09 1978-04-05 Mullard Ltd Ultrasonic bonding apparatus

Also Published As

Publication number Publication date
GB2107235A (en) 1983-04-27
CA1181933A (en) 1985-02-05
GB2107235B (en) 1985-03-20
DE3233629A1 (de) 1983-03-17
DE3233629C2 (index.php) 1993-03-25
US4373653A (en) 1983-02-15
JPS5859811A (ja) 1983-04-09

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