JPH0138914Y2 - - Google Patents
Info
- Publication number
- JPH0138914Y2 JPH0138914Y2 JP1984009020U JP902084U JPH0138914Y2 JP H0138914 Y2 JPH0138914 Y2 JP H0138914Y2 JP 1984009020 U JP1984009020 U JP 1984009020U JP 902084 U JP902084 U JP 902084U JP H0138914 Y2 JPH0138914 Y2 JP H0138914Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- recess
- stem
- jig
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Wire Bonding (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP902084U JPS60121649U (ja) | 1984-01-24 | 1984-01-24 | 気密端子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP902084U JPS60121649U (ja) | 1984-01-24 | 1984-01-24 | 気密端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60121649U JPS60121649U (ja) | 1985-08-16 |
JPH0138914Y2 true JPH0138914Y2 (ko) | 1989-11-21 |
Family
ID=30488840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP902084U Granted JPS60121649U (ja) | 1984-01-24 | 1984-01-24 | 気密端子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60121649U (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50114975A (ko) * | 1974-02-18 | 1975-09-09 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48102947U (ko) * | 1972-03-06 | 1973-12-03 |
-
1984
- 1984-01-24 JP JP902084U patent/JPS60121649U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50114975A (ko) * | 1974-02-18 | 1975-09-09 |
Also Published As
Publication number | Publication date |
---|---|
JPS60121649U (ja) | 1985-08-16 |
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