JPH0137877B2 - - Google Patents
Info
- Publication number
- JPH0137877B2 JPH0137877B2 JP17609181A JP17609181A JPH0137877B2 JP H0137877 B2 JPH0137877 B2 JP H0137877B2 JP 17609181 A JP17609181 A JP 17609181A JP 17609181 A JP17609181 A JP 17609181A JP H0137877 B2 JPH0137877 B2 JP H0137877B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed
- hole
- conductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 99
- 239000004020 conductor Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 17
- 239000010931 gold Substances 0.000 description 17
- 229910052737 gold Inorganic materials 0.000 description 17
- 238000007650 screen-printing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000001994 activation Methods 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- 238000010146 3D printing Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17609181A JPS5877292A (ja) | 1981-11-02 | 1981-11-02 | 印刷配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17609181A JPS5877292A (ja) | 1981-11-02 | 1981-11-02 | 印刷配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5877292A JPS5877292A (ja) | 1983-05-10 |
JPH0137877B2 true JPH0137877B2 (it) | 1989-08-09 |
Family
ID=16007542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17609181A Granted JPS5877292A (ja) | 1981-11-02 | 1981-11-02 | 印刷配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5877292A (it) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01124295A (ja) * | 1987-11-09 | 1989-05-17 | Fujitsu Ltd | プリント配線板の部品取付け孔の形成方法 |
-
1981
- 1981-11-02 JP JP17609181A patent/JPS5877292A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5877292A (ja) | 1983-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3464855A (en) | Process for forming interconnections in a multilayer circuit board | |
US4770900A (en) | Process and laminate for the manufacture of through-hole plated electric printed-circuit boards | |
US3742597A (en) | Method for making a coated printed circuit board | |
KR100427794B1 (ko) | 다층 배선 기판의 제조 방법 | |
JPH0240230B2 (it) | ||
US3522085A (en) | Article and method for making resistors in printed circuit board | |
GB1478341A (en) | Printed circuit board and method of making the same | |
US5680701A (en) | Fabrication process for circuit boards | |
US2965952A (en) | Method for manufacturing etched circuitry | |
KR20010051541A (ko) | 범프 부착 배선회로기판의 제조방법 및 범프 형성방법 | |
EP0337986B1 (en) | Multilayer circuit board fabrication process | |
JPS61288489A (ja) | 成形回路基板の製造方法 | |
USRE29284E (en) | Process for forming interconnections in a multilayer circuit board | |
KR100343389B1 (ko) | 다층 배선기판의 제조방법 | |
JPH0137877B2 (it) | ||
JPH06268355A (ja) | プリント配線板およびその製造方法 | |
JPS6336598A (ja) | 配線板の製造方法 | |
JPS5815957B2 (ja) | 接点付プリント配線基板の製造方法 | |
JPH10284814A (ja) | 回路パターン及びその形成方法 | |
GB1005943A (en) | Multilayer electrical circuit assemblies and processes for producing such assemblies | |
JPS648478B2 (it) | ||
JPS6141303B2 (it) | ||
JPH0224395B2 (it) | ||
JPS6031116B2 (ja) | 電気配線回路基板およびその製造方法 | |
JPS5877287A (ja) | 印刷配線板の製造方法 |