JPH0137877B2 - - Google Patents

Info

Publication number
JPH0137877B2
JPH0137877B2 JP17609181A JP17609181A JPH0137877B2 JP H0137877 B2 JPH0137877 B2 JP H0137877B2 JP 17609181 A JP17609181 A JP 17609181A JP 17609181 A JP17609181 A JP 17609181A JP H0137877 B2 JPH0137877 B2 JP H0137877B2
Authority
JP
Japan
Prior art keywords
plating
printed
hole
conductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17609181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5877292A (ja
Inventor
Eiichi Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP17609181A priority Critical patent/JPS5877292A/ja
Publication of JPS5877292A publication Critical patent/JPS5877292A/ja
Publication of JPH0137877B2 publication Critical patent/JPH0137877B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP17609181A 1981-11-02 1981-11-02 印刷配線板の製造方法 Granted JPS5877292A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17609181A JPS5877292A (ja) 1981-11-02 1981-11-02 印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17609181A JPS5877292A (ja) 1981-11-02 1981-11-02 印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS5877292A JPS5877292A (ja) 1983-05-10
JPH0137877B2 true JPH0137877B2 (it) 1989-08-09

Family

ID=16007542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17609181A Granted JPS5877292A (ja) 1981-11-02 1981-11-02 印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS5877292A (it)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01124295A (ja) * 1987-11-09 1989-05-17 Fujitsu Ltd プリント配線板の部品取付け孔の形成方法

Also Published As

Publication number Publication date
JPS5877292A (ja) 1983-05-10

Similar Documents

Publication Publication Date Title
US3464855A (en) Process for forming interconnections in a multilayer circuit board
US4770900A (en) Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
US3742597A (en) Method for making a coated printed circuit board
KR100427794B1 (ko) 다층 배선 기판의 제조 방법
JPH0240230B2 (it)
US3522085A (en) Article and method for making resistors in printed circuit board
GB1478341A (en) Printed circuit board and method of making the same
US5680701A (en) Fabrication process for circuit boards
US2965952A (en) Method for manufacturing etched circuitry
KR20010051541A (ko) 범프 부착 배선회로기판의 제조방법 및 범프 형성방법
EP0337986B1 (en) Multilayer circuit board fabrication process
JPS61288489A (ja) 成形回路基板の製造方法
USRE29284E (en) Process for forming interconnections in a multilayer circuit board
KR100343389B1 (ko) 다층 배선기판의 제조방법
JPH0137877B2 (it)
JPH06268355A (ja) プリント配線板およびその製造方法
JPS6336598A (ja) 配線板の製造方法
JPS5815957B2 (ja) 接点付プリント配線基板の製造方法
JPH10284814A (ja) 回路パターン及びその形成方法
GB1005943A (en) Multilayer electrical circuit assemblies and processes for producing such assemblies
JPS648478B2 (it)
JPS6141303B2 (it)
JPH0224395B2 (it)
JPS6031116B2 (ja) 電気配線回路基板およびその製造方法
JPS5877287A (ja) 印刷配線板の製造方法