JPH0137725Y2 - - Google Patents

Info

Publication number
JPH0137725Y2
JPH0137725Y2 JP20269283U JP20269283U JPH0137725Y2 JP H0137725 Y2 JPH0137725 Y2 JP H0137725Y2 JP 20269283 U JP20269283 U JP 20269283U JP 20269283 U JP20269283 U JP 20269283U JP H0137725 Y2 JPH0137725 Y2 JP H0137725Y2
Authority
JP
Japan
Prior art keywords
surface treatment
treatment agent
volatile
substrate
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP20269283U
Other languages
Japanese (ja)
Other versions
JPS60112380U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20269283U priority Critical patent/JPS60112380U/en
Publication of JPS60112380U publication Critical patent/JPS60112380U/en
Application granted granted Critical
Publication of JPH0137725Y2 publication Critical patent/JPH0137725Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 (イ) 産業上の利用分野 本考案は表面処理剤の塗布装置に関する。[Detailed explanation of the idea] (b) Industrial application fields The present invention relates to a coating device for a surface treatment agent.

(ロ) 従来技術 所定の形状を有する蒸着薄膜、例えば、超伝導
磁束計に用いる薄膜型のジヨセフソン素子をリフ
ト・オフ法により製作する場合には、第1図に示
すように、表面にフオトレジスト1をコートした
フオトレジスト基板(a)に先づ所定のパターンを画
いて露光処理をほどこした後(b)、フオトレジスト
1の表面をクロルベンゼンで表面処理し、そこに
フオトレジストの硬化層2を形成させる(c)。次の
現像過程でフオトレジストの不要部分を除去し
(d)、超伝導物質を蒸着して(e)、フオトレジストの
除かれた基板上の部分に所定のパターンを示す超
伝導蒸着膜3を形成させる。その後、表面に不要
な蒸着膜3aを有する残留フオトレジストを「リ
フト・オフ」することにより、超伝導蒸着膜3で
構成されたジヨセフソン素子が得られる(f)。
(b) Prior art When manufacturing a vapor-deposited thin film having a predetermined shape, for example, a thin-film Josephson device used in a superconducting magnetometer, by the lift-off method, a photoresist is coated on the surface as shown in Figure 1. After first drawing a predetermined pattern on the photoresist substrate (a) coated with photoresist 1 and subjecting it to exposure treatment (b), the surface of photoresist 1 is treated with chlorobenzene, and a hardened layer of photoresist 2 is applied thereto. (c). In the next development process, unnecessary parts of the photoresist are removed.
(d), a superconducting material is deposited (e), and a superconducting deposited film 3 having a predetermined pattern is formed on the portion of the substrate from which the photoresist has been removed. Thereafter, by "lifting off" the residual photoresist having the unnecessary vapor deposited film 3a on its surface, a Josephson device made of the superconducting vapor deposited film 3 is obtained (f).

以上の工程においてフオトレジスト1の表面を
クロルベンゼンで処理する際、従来は換気設備の
ある部屋で、開放容器にいれたクロルベンゼン中
にフオトレジスト基板を漬けるか、あるいは、ク
ロルベンゼンをフオトレジスト面に塗布し、適当
な時間の経過後、ドライヤーで残留クロルベンゼ
ンを蒸発除去する方法がとられてきた。
In the above process, when the surface of the photoresist 1 is treated with chlorobenzene, conventionally the photoresist substrate is immersed in chlorobenzene in an open container in a room with ventilation equipment, or chlorobenzene is applied to the photoresist surface. A method has been used in which the residual chlorobenzene is removed by evaporation using a dryer after a suitable period of time has passed.

しかし、このような方法では、第二種有機溶剤
であるクロルベンゼンの有害で可燃性の蒸気が作
業場に充満する危険があり、また、上記のような
方法ではフオトレジストの処理時間を正確にコン
トロールすることができず、フオトレジスト硬化
層の特性を一定に保つことは不可能である。
However, with this method, there is a risk that the workplace will be filled with harmful and flammable vapors from chlorobenzene, a type II organic solvent, and the method described above does not allow accurate control of photoresist processing time. Therefore, it is impossible to keep the properties of the photoresist hardened layer constant.

(ハ) 目的 本考案の目的は、クロルベンゼンのような可燃
性有害ガスの発生を伴う表面処理剤を、従来技術
によりフオトレジスト基板等の板状材料の表面に
塗布する場合に生ずる、上記のような欠点を排除
し、表面処理剤およびその揮発性ガスが直接外気
に触れ、または混入することのない完全密閉型の
表面処理剤塗布装置を提供することにある。
(C) Purpose The purpose of the present invention is to eliminate the above-mentioned problems that occur when a surface treatment agent that generates flammable and harmful gases, such as chlorobenzene, is applied to the surface of a plate-like material such as a photoresist substrate using conventional techniques. It is an object of the present invention to provide a completely sealed surface treatment agent application device that eliminates such drawbacks and prevents the surface treatment agent and its volatile gas from directly coming into contact with or being mixed with the outside air.

(ニ) 構成 上記の目的を達成するため、本考案による装置
は、表面処理剤を塗布するために基板を収納・保
持する密閉型の基板保持容器と、表面処理剤を貯
蔵するタンクと、上記表面処理剤の揮発ガスを補
獲するガスフイルタと、当該装置の系内で上記表
面処理剤を移送するための圧縮ガスを供給する圧
縮ガス供給手段とが、配管系を介して上記表面処
理剤の揮発ガスに対する閉鎖系を形成して成り、
上記揮発ガスが当該装置の系外に排出されないよ
う構成されたことを特徴としている。
(D) Structure In order to achieve the above object, the apparatus according to the present invention includes a sealed substrate holding container for storing and holding a substrate for applying a surface treatment agent, a tank for storing the surface treatment agent, and a tank for storing the surface treatment agent. A gas filter that captures the volatile gas of the surface treatment agent and a compressed gas supply means that supplies compressed gas for transporting the surface treatment agent within the system of the device are connected to the surface treatment agent through a piping system. It forms a closed system against volatile gases,
The device is characterized in that it is configured so that the volatile gas is not discharged outside the system.

(ホ) 実施例 以下に本考案の実施例を、その構成を示す第2
図に基づいて説明する。同図において、四方弁6
の操作位置は、表面処理剤移送用圧縮窒素ガス供
給源よりの配管5と表面処理剤貯蔵タンク9の内
圧コントロール用配管7の間、および排気管16
と基板保持容器の内圧コントロール用配管15の
間をそれぞれ連通させた状態に画かれているが、
この四方弁6は、90゜の回転操作により、圧縮ガ
ス供給配管15を基板保持容器の内圧コントロー
ル用配管15に、そしてまた、表面処理剤貯蔵タ
ンクの内圧コントロール用配管7を排気管16に
連通させるよう切り換えることができる。
(e) Example The following is an example of the present invention, and a second example showing its configuration.
This will be explained based on the diagram. In the same figure, the four-way valve 6
The operation position is between the pipe 5 from the compressed nitrogen gas supply source for surface treatment agent transfer and the internal pressure control pipe 7 of the surface treatment agent storage tank 9, and the exhaust pipe 16.
Although the drawing shows communication between the internal pressure control pipe 15 and the internal pressure control pipe 15 of the substrate holding container,
This four-way valve 6 connects the compressed gas supply pipe 15 to the internal pressure control pipe 15 of the substrate holding container, and also connects the internal pressure control pipe 7 of the surface treatment agent storage tank to the exhaust pipe 16 by rotating it 90 degrees. You can switch to

ところで、第2図に示した四方弁6の操作位置
において、圧縮窒素ガスは、その供給源の配管5
より、貯蔵タンク内圧コントロール配管7を通じ
て、表面処理剤貯蔵タンク9に導入され、表面処
理剤8の液面を加圧する。この圧力により表面処
理剤8は配管10、開放状態になつている開閉弁
11を通つて基板保持器12に送入される。この
とき、この容器内の圧力は、基板保持容器内圧コ
ントロール配管15、四方弁6、および排気管1
6を経てガスフイルタ14に導かれ、そこで表面
処理剤からの揮発ガス成分がトラツプされ、窒素
ガス成分のみとなつて外気に開放されている。基
板保持容器12に導入された表面処理剤の液面
は、排液管13の垂直立上り部(透明ガラス管で
できている)が液面計の働きを兼ね、そこに表示
される。基板保持容器12の中にあらかじめ収容
されている被処理基板17を浸すに充分な高さま
で表面処理剤がたまれば、開閉弁11を閉じて表
面処理剤の注入を断ち、基板17の表面処理に必
要な所定の時間放置する。
By the way, in the operating position of the four-way valve 6 shown in FIG.
The surface treatment agent is introduced into the surface treatment agent storage tank 9 through the storage tank internal pressure control piping 7, and the liquid level of the surface treatment agent 8 is pressurized. This pressure causes the surface treatment agent 8 to be fed into the substrate holder 12 through the piping 10 and the on-off valve 11 which is in an open state. At this time, the pressure inside this container is controlled by the substrate holding container internal pressure control piping 15, the four-way valve 6, and the exhaust pipe 1.
6 and is led to a gas filter 14, where volatile gas components from the surface treatment agent are trapped and only nitrogen gas components are released to the outside air. The liquid level of the surface treatment agent introduced into the substrate holding container 12 is displayed on the vertical rising part of the liquid drain pipe 13 (made of a transparent glass tube) which also functions as a liquid level gauge. When the surface treatment agent accumulates to a sufficient height to submerge the substrate 17 to be processed, which has been stored in advance in the substrate holding container 12, the on-off valve 11 is closed to cut off the injection of the surface treatment agent, and the surface treatment of the substrate 17 is completed. Leave it for the required time.

その後四方弁6に90゜の回転操作をし、配管5
を基板保持容器内圧コントロール配管15に、貯
蔵タンク内圧コントロール配管7を排気管16に
連通させると、圧縮窒素ガスが基板保持容器12
に導入され、その中の残留表面処理剤は排液管1
3を経てガスフイルタ14に排出される。ガスフ
イルタ14は表面処理剤およびその揮発ガスをト
ラツプし、窒素ガスのみを外気中に放出する。表
面処理剤排出後も基板表面が完全に乾燥するまで
窒素ガスの供給を続ける。一方、表面処理剤貯蔵
タンク9内の圧力は、導管7が四方弁6を介して
排気管16に連通しているので、これらの通路を
経てガスフイルタ14に導かれ、揮発ガス成分は
そこでトラツプされ、窒素ガス成分だけとなつて
外気中に開放される。
After that, rotate the four-way valve 6 by 90 degrees, and
When the storage tank internal pressure control piping 7 is connected to the substrate holding container internal pressure control piping 15 and the storage tank internal pressure control piping 7 is connected to the exhaust pipe 16, compressed nitrogen gas flows into the substrate holding container 12.
The residual surface treatment agent therein is introduced into the drain pipe 1.
3 and is discharged to the gas filter 14. Gas filter 14 traps the surface treatment agent and its volatile gas, and releases only nitrogen gas to the outside air. Even after discharging the surface treatment agent, continue supplying nitrogen gas until the substrate surface is completely dry. On the other hand, since the conduit 7 communicates with the exhaust pipe 16 via the four-way valve 6, the pressure inside the surface treatment agent storage tank 9 is guided to the gas filter 14 through these passages, and volatile gas components are trapped there. , only the nitrogen gas component is released into the outside air.

(ヘ) 効果 以上の説明から明らかなように、本考案によれ
ば、表面処理剤は、それ自体およびその揮発ガス
に関して完全なクローズドシステム内で取り扱わ
れるので、可燃性有害ガスが外気中に混入する危
険が防止され、また、基板面の処理時間もバルブ
の操作だけで自由にコントロールできるので、表
面処理の品質管理が容易となる。
(F) Effect As is clear from the above explanation, according to the present invention, the surface treatment agent itself and its volatile gases are handled in a completely closed system, so that no flammable harmful gases are mixed into the outside air. Furthermore, since the processing time for the substrate surface can be controlled freely by simply operating the valve, quality control of surface processing becomes easy.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はリフトオフ法によるフオトレジストの
処理工程を示す図である。第2図は本考案実施例
の構成を示す図である。 5……圧縮ガス供給管、6……四方弁、7……
タンク内圧のコントロール用配管、8……表面処
理剤、9……表面処理剤貯蔵タンク、10……導
管、11……開閉弁、12……気密容器、13…
…排液管、14……ガスフイルタ、15……基板
保持容器の内圧コントロール用配管。
FIG. 1 is a diagram showing a photoresist treatment process using a lift-off method. FIG. 2 is a diagram showing the configuration of an embodiment of the present invention. 5... Compressed gas supply pipe, 6... Four-way valve, 7...
Piping for controlling tank internal pressure, 8...Surface treatment agent, 9...Surface treatment agent storage tank, 10...Conduit, 11...Opening/closing valve, 12...Airtight container, 13...
...Drain pipe, 14...Gas filter, 15...Piping for controlling the internal pressure of the substrate holding container.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 揮発性の表面処理剤を基板面に塗布するための
装置であつて、表面処理剤を塗布するために基板
を収納・保持する密閉型の基板保持容器と、表面
処理剤を貯蔵するタンクと、上記表面処理剤の揮
発ガスを捕獲するガスフイルタと、当該装置の系
内で上記表面処理剤を移送するための圧縮ガスを
供給する圧縮ガス供給手段とが、配管系を介して
上記表面処理剤の揮発ガスに対する閉鎖系を形成
して成り、上記揮発ガスが当該装置の系外に排出
されないよう構成されたことを特徴とする、表面
処理剤塗布装置。
An apparatus for applying a volatile surface treatment agent to a substrate surface, the device comprising: a sealed substrate holding container for storing and holding a substrate for applying the surface treatment agent; and a tank for storing the surface treatment agent; A gas filter that captures the volatile gas of the surface treatment agent and a compressed gas supply means that supplies compressed gas for transporting the surface treatment agent within the system of the device are connected to each other through a piping system to capture the volatile gas of the surface treatment agent. 1. A surface treatment agent application device, characterized in that it forms a closed system for volatile gases, and is configured so that the volatile gases are not discharged outside the system.
JP20269283U 1983-12-28 1983-12-28 Surface treatment agent coating equipment Granted JPS60112380U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20269283U JPS60112380U (en) 1983-12-28 1983-12-28 Surface treatment agent coating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20269283U JPS60112380U (en) 1983-12-28 1983-12-28 Surface treatment agent coating equipment

Publications (2)

Publication Number Publication Date
JPS60112380U JPS60112380U (en) 1985-07-30
JPH0137725Y2 true JPH0137725Y2 (en) 1989-11-14

Family

ID=30765130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20269283U Granted JPS60112380U (en) 1983-12-28 1983-12-28 Surface treatment agent coating equipment

Country Status (1)

Country Link
JP (1) JPS60112380U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2898318B2 (en) * 1989-11-10 1999-05-31 三菱電機株式会社 Method and apparatus for forming organic thin film

Also Published As

Publication number Publication date
JPS60112380U (en) 1985-07-30

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