JPH0137264B2 - - Google Patents
Info
- Publication number
- JPH0137264B2 JPH0137264B2 JP7216380A JP7216380A JPH0137264B2 JP H0137264 B2 JPH0137264 B2 JP H0137264B2 JP 7216380 A JP7216380 A JP 7216380A JP 7216380 A JP7216380 A JP 7216380A JP H0137264 B2 JPH0137264 B2 JP H0137264B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- laminate
- pcm
- resins
- varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 229920001187 thermosetting polymer Polymers 0.000 claims description 14
- 239000002966 varnish Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- OSDLLIBGSJNGJE-UHFFFAOYSA-N 4-chloro-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1Cl OSDLLIBGSJNGJE-UHFFFAOYSA-N 0.000 claims description 5
- 230000000844 anti-bacterial effect Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 239000003242 anti bacterial agent Substances 0.000 description 10
- 241000894006 Bacteria Species 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 206010034133 Pathogen resistance Diseases 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002135 phase contrast microscopy Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7216380A JPS56169054A (en) | 1980-05-31 | 1980-05-31 | Manufacture of laminated board having fungus-proofness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7216380A JPS56169054A (en) | 1980-05-31 | 1980-05-31 | Manufacture of laminated board having fungus-proofness |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56169054A JPS56169054A (en) | 1981-12-25 |
| JPH0137264B2 true JPH0137264B2 (en, 2012) | 1989-08-04 |
Family
ID=13481299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7216380A Granted JPS56169054A (en) | 1980-05-31 | 1980-05-31 | Manufacture of laminated board having fungus-proofness |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56169054A (en, 2012) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1120087A (ja) * | 1997-06-30 | 1999-01-26 | Idemitsu Petrochem Co Ltd | 抗菌防かび作用を有する積層体 |
-
1980
- 1980-05-31 JP JP7216380A patent/JPS56169054A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56169054A (en) | 1981-12-25 |
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