JPH0137003B2 - - Google Patents
Info
- Publication number
- JPH0137003B2 JPH0137003B2 JP58098237A JP9823783A JPH0137003B2 JP H0137003 B2 JPH0137003 B2 JP H0137003B2 JP 58098237 A JP58098237 A JP 58098237A JP 9823783 A JP9823783 A JP 9823783A JP H0137003 B2 JPH0137003 B2 JP H0137003B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- substrate
- pattern
- coil
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 86
- 229910000859 α-Fe Inorganic materials 0.000 claims description 33
- 239000002131 composite material Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000004907 flux Effects 0.000 description 9
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 5
- 230000035699 permeability Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H5/00—One-port networks comprising only passive electrical elements as network components
- H03H5/02—One-port networks comprising only passive electrical elements as network components without voltage- or current-dependent elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1775—Parallel LC in shunt or branch path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1783—Combined LC in series path
Landscapes
- Filters And Equalizers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9823783A JPS59223011A (ja) | 1983-06-01 | 1983-06-01 | 複合lcフイルタ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9823783A JPS59223011A (ja) | 1983-06-01 | 1983-06-01 | 複合lcフイルタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59223011A JPS59223011A (ja) | 1984-12-14 |
JPH0137003B2 true JPH0137003B2 (US08066781-20111129-C00013.png) | 1989-08-03 |
Family
ID=14214347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9823783A Granted JPS59223011A (ja) | 1983-06-01 | 1983-06-01 | 複合lcフイルタ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59223011A (US08066781-20111129-C00013.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2663270B2 (ja) * | 1988-02-15 | 1997-10-15 | 株式会社村田製作所 | 共振器及びその製造方法 |
JPH0210105U (US08066781-20111129-C00013.png) * | 1988-07-04 | 1990-01-23 | ||
WO2006085625A1 (ja) * | 2005-02-10 | 2006-08-17 | Soshin Electric Co., Ltd. | 電子部品 |
JP4401981B2 (ja) | 2005-02-16 | 2010-01-20 | 双信電機株式会社 | フィルタ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5978723U (ja) * | 1982-11-19 | 1984-05-28 | ティーディーケイ株式会社 | Lcフイルタ |
-
1983
- 1983-06-01 JP JP9823783A patent/JPS59223011A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59223011A (ja) | 1984-12-14 |
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