JPH0135478Y2 - - Google Patents
Info
- Publication number
- JPH0135478Y2 JPH0135478Y2 JP10643584U JP10643584U JPH0135478Y2 JP H0135478 Y2 JPH0135478 Y2 JP H0135478Y2 JP 10643584 U JP10643584 U JP 10643584U JP 10643584 U JP10643584 U JP 10643584U JP H0135478 Y2 JPH0135478 Y2 JP H0135478Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- recess
- support plate
- strips
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000004065 semiconductor Substances 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10643584U JPS6122351U (ja) | 1984-07-16 | 1984-07-16 | 樹脂封止形半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10643584U JPS6122351U (ja) | 1984-07-16 | 1984-07-16 | 樹脂封止形半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6122351U JPS6122351U (ja) | 1986-02-08 |
| JPH0135478Y2 true JPH0135478Y2 (US08124630-20120228-C00152.png) | 1989-10-30 |
Family
ID=30665723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10643584U Granted JPS6122351U (ja) | 1984-07-16 | 1984-07-16 | 樹脂封止形半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6122351U (US08124630-20120228-C00152.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH079917B2 (ja) * | 1987-05-11 | 1995-02-01 | サンケン電気株式会社 | 樹脂封止型半導体装置の製造方法 |
| JPH04132734U (ja) * | 1991-05-29 | 1992-12-09 | 日本電気株式会社 | 圧電振動子 |
-
1984
- 1984-07-16 JP JP10643584U patent/JPS6122351U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6122351U (ja) | 1986-02-08 |
