JPH0132366Y2 - - Google Patents
Info
- Publication number
- JPH0132366Y2 JPH0132366Y2 JP8478283U JP8478283U JPH0132366Y2 JP H0132366 Y2 JPH0132366 Y2 JP H0132366Y2 JP 8478283 U JP8478283 U JP 8478283U JP 8478283 U JP8478283 U JP 8478283U JP H0132366 Y2 JPH0132366 Y2 JP H0132366Y2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- rectangular parallelepiped
- view
- sides
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000004033 plastic Substances 0.000 description 10
- 238000004806 packaging method and process Methods 0.000 description 6
- 239000011295 pitch Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8478283U JPS59189251U (ja) | 1983-06-03 | 1983-06-03 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8478283U JPS59189251U (ja) | 1983-06-03 | 1983-06-03 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59189251U JPS59189251U (ja) | 1984-12-15 |
| JPH0132366Y2 true JPH0132366Y2 (enrdf_load_stackoverflow) | 1989-10-03 |
Family
ID=30214749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8478283U Granted JPS59189251U (ja) | 1983-06-03 | 1983-06-03 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189251U (enrdf_load_stackoverflow) |
-
1983
- 1983-06-03 JP JP8478283U patent/JPS59189251U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59189251U (ja) | 1984-12-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6313998B1 (en) | Circuit board assembly having a three dimensional array of integrated circuit packages | |
| US6908792B2 (en) | Chip stack with differing chip package types | |
| JP4159636B2 (ja) | 電子部品パッケージ及びその製造方法 | |
| CA1202383A (en) | Thick film delay line | |
| JPH064595Y2 (ja) | ハイブリッドｉｃ | |
| CA2095609C (en) | Leadless pad array chip carrier | |
| US5381047A (en) | Semiconductor integrated circuit having multiple silicon chips | |
| JP2955842B2 (ja) | 半導体パッケージ | |
| JPH0132366Y2 (enrdf_load_stackoverflow) | ||
| US20020043709A1 (en) | Stackable integrated circuit | |
| JPH05343610A (ja) | 混成集積回路装置 | |
| KR100373149B1 (ko) | 반도체 패키지 | |
| US20120104609A1 (en) | Discrete circuit component having copper block electrodes and method of fabrication | |
| WO2022123785A1 (ja) | ３次元実装集積回路 | |
| KR100464561B1 (ko) | 반도체 패키지 및 이것의 제조방법 | |
| JPS589585B2 (ja) | デンシブヒンヨウリ−ドフレ−ム | |
| JPH0439668Y2 (enrdf_load_stackoverflow) | ||
| JPH04237154A (ja) | 半導体パッケージ | |
| JPS6297416A (ja) | チツプ形遅延素子の構成方法 | |
| JPH0514516Y2 (enrdf_load_stackoverflow) | ||
| JP2550477B2 (ja) | メモリ装置用部品取付板およびメモリユニット | |
| JPH0969587A (ja) | Ｂｇａ型半導体装置及びｂｇａモジュール | |
| JPH0121568Y2 (enrdf_load_stackoverflow) | ||
| JPS62209892A (ja) | 複合チツプ部品の実装方法 | |
| JPH065732A (ja) | 半導体装置 |